Park Systems, Inc. XE-3DM

Park Systems has revolutionized the AFM with the introduction of the XE-3DM, the fully automated AFM system designed for overhang and trench profiles, sidewall roughness and imaging, and critical angle measurements. The unique design of the XE-3DM, made possible by the XE-series’ decoupled XY and Z scanning system, allows for characterization of undercut features as well as top surfaces. In using Park Systems’ True Non-Contact mode, the XE-3DM can realize non-destructive imaging of soft photoresist structures at the same scanning speed as any other XE-series platform. High Resolution Access to Undercut and Sidewall • Two independent, closed-loop XY and Z flexure scanners for sample and tip • Z-scanner is tilted sideways from -40 to +40 degrees • Use of normal high aspect ratio tips for high resolution imaging • XY scan of up to 100 μm x 100 μm • Up to 25 um Z scan range by high force scanner Non-destructive CD and Sidewall Measurements by True Non-Contact Mode • 10 times larger Z-scan bandwidth than a piezotube • Less tip wear for prolonged high-quality and high-resolution imaging • Minimized sample damage or modification • Soft photoresist structures can be imaged non-destructively • Immunity from parameter-dependent results observed in tapping imaging Complete 3D Metrology of Sidewall • Sidewall roughness measurement • Critical angle measurement of sidewalls • Critical dimension measurements of vertical sidewalls High Throughput Inline Automation • Allowable sample size: 200/300mm wafers • Automatic data acquisition and analysis of trench, overhang, and undercut Features • Automatic tip exchange (optional) • Equipment Front End Module (EFEM) for wafer Handling (optional) • Cleanroom compatibility and remote control interface