NPN general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
Features and benefits
High power dissipation capability
High current
Three current gain selections
Suitable for Automatic Optical Inspection (AOI) of solder joint
Smaller footprint compared to conventional leaded SMD packages
Low package height of 0.5 mm
Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
General-purpose switching and amplification
Space restricted applications
NPN general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
Features and benefits
- High power dissipation capability
- High current
- Three current gain selections
- Suitable for Automatic Optical Inspection (AOI) of solder joint
- Smaller footprint compared to conventional leaded SMD packages
- Low package height of 0.5 mm
- Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
- General-purpose switching and amplification
- Space restricted applications