10mm DIP Rotaries
100mA Logic Level, Bushing and PCB Mount (FR01 series through hole and FR02 series SMT), Decimal and Hexadecimal
Environmentally friendly components and packaging materials meet RoHS directive restricting use of hazardous substances.
Suited to lead-free solder processing applications because of heat resistant resin materials.
Slim .150" (3.8mm) body has the lowest profile in the industry and allows close PCB stacking.
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10mm DIP Rotaries
100mA Logic Level, Bushing and PCB Mount (FR01 series through hole and FR02 series SMT), Decimal and Hexadecimal
Environmentally friendly components and packaging materials meet RoHS directive restricting use of hazardous substances.
Suited to lead-free solder processing applications because of heat resistant resin materials.
Slim .150" (3.8mm) body has the lowest profile in the industry and allows close PCB stacking.
10mm DIP Rotaries
100mA Logic Level, Bushing and PCB Mount (FR01 series through hole and FR02 series SMT), Decimal and Hexadecimal
Environmentally friendly components and packaging materials meet RoHS directive restricting use of hazardous substances.
Suited to lead-free solder processing applications because of heat resistant resin materials.
Slim .150" (3.8mm) body has the lowest profile in the industry and allows close PCB stacking.
10mm DIP Rotaries
100mA Logic Level, Bushing and PCB Mount (FR01 series through hole and FR02 series SMT), Decimal and Hexadecimal
Environmentally friendly components and packaging materials meet RoHS directive restricting use of hazardous substances.
Suited to lead-free solder processing applications because of heat resistant resin materials.
Slim .150" (3.8mm) body has the lowest profile in the industry and allows close PCB stacking.
