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Master Bond, Inc. Low Viscosity, Thermally Conductive Underfill Epoxy EP3UF-1

Description
Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.
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Description
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Low Viscosity, Thermally Conductive Underfill Epoxy - EP3UF-1 - Master Bond, Inc.
Hackensack, NJ, USA
Low Viscosity, Thermally Conductive Underfill Epoxy
EP3UF-1
Low Viscosity, Thermally Conductive Underfill Epoxy EP3UF-1
Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.

Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Adhesives
Product Number EP3UF-1
Product Name Low Viscosity, Thermally Conductive Underfill Epoxy
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
Composition Unfilled
Type / Form Liquid
Features High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive
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