Master Bond, Inc. One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability EP3HTSDA-2

Description
Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.
Request a Quote
Description
Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability - EP3HTSDA-2 - Master Bond, Inc.
Hackensack, NJ, USA
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
EP3HTSDA-2
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability EP3HTSDA-2
Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.

Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Specialty Adhesives, Sealants, and Compounds
Product Number EP3HTSDA-2
Product Name One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Type / Form Liquid
Composition Filled
Cure / Technology Thermoset; Single Component
Unlock Full Specs
to access all available technical data

Similar Products

USP Class VI Two Component Epoxy Resin System - EP62-1Med - Master Bond, Inc.
Specs
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic
Chemical System Epoxy
Composition Unfilled
View Details
Flexibilized Epoxy System - Supreme 10HTFL - Master Bond, Inc.
Specs
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Chemical System Epoxy
Type / Form Liquid
View Details
Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test - EP93AOFR - Master Bond, Inc.
Specs
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Type / Form Liquid
View Details
One Component, High Viscosity UV Curable Compound - UV15X-5 - Master Bond, Inc.
Specs
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Elastomeric
Type / Form Liquid
View Details