Master Bond, Inc. One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability EP3HTSDA-2

Description
Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.
Request a Quote
Description
Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability - EP3HTSDA-2 - Master Bond, Inc.
Hackensack, NJ, USA
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
EP3HTSDA-2
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability EP3HTSDA-2
Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.

Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Specialty Adhesives, Sealants, and Compounds
Product Number EP3HTSDA-2
Product Name One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Chemical System Epoxy
Type / Form Liquid
Composition Filled
Cure / Technology Thermoset; Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Two Component, Room Temperature Curing Epoxy - EP21ND - Master Bond, Inc.
Specs
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Chemical System Polyurethane; Epoxy
Composition Filled
View Details
Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy - EP3HTS-TC - Master Bond, Inc.
Specs
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Composition Filled
View Details
Thermally Conductive, Dimensionally Stable Epoxy - EP30AN - Master Bond, Inc.
Specs
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Composition Filled
View Details
Flexible, Two Component Silver Conductive Epoxy - EP21TDCSFL - Master Bond, Inc.
Specs
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Chemical System Polyurethane; Epoxy
Composition Filled
View Details