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Master Bond, Inc. Flexibilized, Thermally Conductive Epoxy Adhesive EP30FLAO

Description
Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a ten-to-one (10:1) mix ratio by weight. It has an attractive balance of performance properties including high thermal conductivity, superior dimensional stability, physical properties, toughness and electrical insulation. EP30FLAO is a low viscosity epoxy with excellent flow characteristics making it ideal as a thermally conductive potting compound. EP30FLAO is also an excellent adhesive/sealant forming durable, flexibilized bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents. It has a wide service temperature range of -60°F to 250°F. EP30FLAO has a desirably low coefficient of themal expansion making it an excellent choice for many potting applications. Color coding of EP30FLAO makes mixing easy part A is off white, part B is clear. Master Bond EP30FLAO is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation, environmental protection, and heat transfer is required.
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Suppliers

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Description
Supplier Links
Flexibilized, Thermally Conductive Epoxy Adhesive - EP30FLAO - Master Bond, Inc.
Hackensack, NJ, USA
Flexibilized, Thermally Conductive Epoxy Adhesive
EP30FLAO
Flexibilized, Thermally Conductive Epoxy Adhesive EP30FLAO
Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a ten-to-one (10:1) mix ratio by weight. It has an attractive balance of performance properties including high thermal conductivity, superior dimensional stability, physical properties, toughness and electrical insulation. EP30FLAO is a low viscosity epoxy with excellent flow characteristics making it ideal as a thermally conductive potting compound. EP30FLAO is also an excellent adhesive/sealant forming durable, flexibilized bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents. It has a wide service temperature range of -60°F to 250°F. EP30FLAO has a desirably low coefficient of themal expansion making it an excellent choice for many potting applications. Color coding of EP30FLAO makes mixing easy part A is off white, part B is clear. Master Bond EP30FLAO is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation, environmental protection, and heat transfer is required.

Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a ten-to-one (10:1) mix ratio by weight. It has an attractive balance of performance properties including high thermal conductivity, superior dimensional stability, physical properties, toughness and electrical insulation. EP30FLAO is a low viscosity epoxy with excellent flow characteristics making it ideal as a thermally conductive potting compound. EP30FLAO is also an excellent adhesive/sealant forming durable, flexibilized bonds that are resistant to thermal cycling and chemicals including water, oil and most organic solvents. It has a wide service temperature range of -60°F to 250°F. EP30FLAO has a desirably low coefficient of themal expansion making it an excellent choice for many potting applications. Color coding of EP30FLAO makes mixing easy part A is off white, part B is clear. Master Bond EP30FLAO is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation, environmental protection, and heat transfer is required.

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Technical Specifications

  Master Bond, Inc.
Product Category Industrial Adhesives
Product Number EP30FLAO
Product Name Flexibilized, Thermally Conductive Epoxy Adhesive
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Epoxy
Type / Form Liquid
Features High Dielectric
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
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