Infineon Technologies AG Memory 8611200993

Description
INTEGRATED CIRCUIT
  • Memory - 8611200993 - Lingto Electronic Limited
    Lingto Electronic Limited
  • Memory - 8611200993 - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Datasheet
Description
INTEGRATED CIRCUIT
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 8611200993 - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Memory
8611200993
Memory 8611200993
INTEGRATED CIRCUIT

INTEGRATED CIRCUIT

Supplier's Site Datasheet
Memory - 8611200993 - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory
8611200993
Memory 8611200993
Memory IC

Memory IC

Buy Now

Technical Specifications

  Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips
Product Number 8611200993 8611200993
Product Name Memory Memory
Unlock Full Specs
to access all available technical data

Similar Products

Memory IC and Storage Component - 736-DP8409AD - ERSAELECTRONICS PTE. LTD.
Texas Instruments
Memory IC and Storage Component
DP8409AD
Specs
Memory Category DRAM Chip
Operating Temperature 0 to 70 C (32 to 158 F)
Package Type Bulk
View Details
2 suppliers
Logic - FIFOs Memory - 67C4033-10N - Lingto Electronic Limited
Rochester Electronics
Logic - FIFOs Memory
67C4033-10N
Specs
Data Rate 10 MHz
Operating Current 35 mA
View Details
Memory - AS5SS256K18 - Micross Components, Inc.
Micross Components, Inc.
Memory
AS5SS256K18
Specs
Memory Category SSRAM; SRAM Chip
Operating Temperature -55 to 125 C (-67 to 257 F)
Density 2048 kbits
View Details
Infineon Technologies AG
Memory IC and Storage Component
ADM6993X-AD-T-1
Specs
Operating Temperature 0 to 115 C (32 to 239 F)
Package Type QFP; Tray
Supply Voltage 3.135V ~ 3.465V
View Details