PoP Paste Indium9.91 is a no-clean solder paste designed for use in package-on-package (0.3mm and larger) applications. PoP Paste Indium9.91 has a rheology designed to provide a long-lasting dipping process.
Features:
Eliminates defects due to package-warping
Air-reflow
Rheology optimized for both dipping and package-retention
Designed for use with SAC305 and Sn63/Pb37 alloys
Excellent solderability
Long pot life
Suitable for use down to 0.3mm pitch
PoP Paste Indium9.91 is a no-clean solder paste designed for use in package-on-package (0.3mm and larger) applications. PoP Paste Indium9.91 has a rheology designed to provide a long-lasting dipping process.
Features:
- Eliminates defects due to package-warping
- Air-reflow
- Rheology optimized for both dipping and package-retention
- Designed for use with SAC305 and Sn63/Pb37 alloys
- Excellent solderability
- Long pot life
- Suitable for use down to 0.3mm pitch
