PoP Paste Indium5.79 is a no-clean solder paste designed for use in package-on-package and finerpitch (0.4mm and larger) BGA rework applications. PoP Paste Indium5.79 has a rheology designed to provide a long-lasting dipping process.
Features
Eliminates defects due to package-warping
Air-reflow
Rheology optimized for both dipping and package-retention
Designed for use with SAC305
Excellent solderability
Long pot life
Suitable for use down to 0.4mm pitch
High metal load (>85%w/w) reduces slump/ spread
PoP Paste Indium5.79 is a no-clean solder paste designed for use in package-on-package and finerpitch (0.4mm and larger) BGA rework applications. PoP Paste Indium5.79 has a rheology designed to provide a long-lasting dipping process.
Features
- Eliminates defects due to package-warping
- Air-reflow
- Rheology optimized for both dipping and package-retention
- Designed for use with SAC305
- Excellent solderability
- Long pot life
- Suitable for use down to 0.4mm pitch
- High metal load (>85%w/w) reduces slump/ spread
