LED TACFlux® 007 is the leading die-attach flux for the light-emitting diode (LED) industry. It was specifically designed for die-to-sub-mount applications with sputtered film or solder preform alloys, with melting points that range from from tin-silver (Sn/ Ag), SAC (Sn/Ag/Cu) and pure tin (Sn) up to goldtin (Au/Sn) eutectic, and is approved by leading LED manufacturers, such as Cree, for this purpose(1). It may be applied using various application techniques, holds the die in place during reflow, and is easily cleaned to give high wirebond pull-strengths. The use of small quantities is recommended for best results.
| Indium Corporation | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | LED TACFlux® 007 |
| Product Name | TACFlux |
| Fluxes & Cleaners | Soldering Flux / Rosin |
