Indium Corporation Solder Paste Indium5.7LT Solder Paste

Description
Indium5.7LT is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using eutectic SnBi and SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities. The low activation temperature of Indium5.7LT, in combination with the SnBi alloy, can be especially useful as a low temperature, Pb-free solution.
Description
Indium5.7LT is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using eutectic SnBi and SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities. The low activation temperature of Indium5.7LT, in combination with the SnBi alloy, can be especially useful as a low temperature, Pb-free solution.

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Indium5.7LT is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using eutectic SnBi and SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities. The low activation temperature of Indium5.7LT, in combination with the SnBi alloy, can be especially useful as a low temperature, Pb-free solution.

Indium5.7LT is an air reflow, halogen-free, no-clean solder paste designed for assembly processes using eutectic SnBi and SnBiAg alloys. This paste is a moderate residue product with exceptional wetting capabilities. The low activation temperature of Indium5.7LT, in combination with the SnBi alloy, can be especially useful as a low temperature, Pb-free solution.

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Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Indium5.7LT Solder Paste
Product Name Solder Paste
Joining Process / Product Form Braze or solder in the form of a paste.
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