Indium Corporation Solder Paste Indium10.5HF Pb-Free Solder Paste

Description
Indium10.5HF is no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. Flux residues remain soft, pliable, yet non-tacky after reflow in order to provide the best in-circuit testing (ICT) performance. Indium10.5HF offers industry-leading stencil printing performance (excellent response-to-pause and consistent printing even at high print speeds). Oxidation barrier technology delivers superior solderability and wetting on many surface finishes.
Description
Indium10.5HF is no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. Flux residues remain soft, pliable, yet non-tacky after reflow in order to provide the best in-circuit testing (ICT) performance. Indium10.5HF offers industry-leading stencil printing performance (excellent response-to-pause and consistent printing even at high print speeds). Oxidation barrier technology delivers superior solderability and wetting on many surface finishes.

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Indium10.5HF is no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. Flux residues remain soft, pliable, yet non-tacky after reflow in order to provide the best in-circuit testing (ICT) performance. Indium10.5HF offers industry-leading stencil printing performance (excellent response-to-pause and consistent printing even at high print speeds). Oxidation barrier technology delivers superior solderability and wetting on many surface finishes.

Indium10.5HF is no-clean solder paste, specifically formulated for today’s Pb-free (Sn-based) alloys for PCB assembly in nitrogen or air reflow. Flux residues remain soft, pliable, yet non-tacky after reflow in order to provide the best in-circuit testing (ICT) performance. Indium10.5HF offers industry-leading stencil printing performance (excellent response-to-pause and consistent printing even at high print speeds). Oxidation barrier technology delivers superior solderability and wetting on many surface finishes.

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Technical Specifications

  Indium Corporation
Product Category Filler Alloys and Consumables
Product Number Indium10.5HF Pb-Free Solder Paste
Product Name Solder Paste
Joining Process / Product Form Braze or solder in the form of a paste.
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