Features
Flux rheology applicable for all sphere sizes
Suitable for Pb-free or SnPb applications
Uniform pin transfer over extended periods
Red color for ease of detection
Proven high yields in ball-attach process
Excellent solderability on a wide range of surfaces
Introduction
Ball Attach Flux WS-3600 is a thixotropic flux designed for use in pin transfer applications for ball attachment to substrates (BGA manufacturing). Its rheology is specifically designed for use with even the smallest gravity-fed spheres. WS-3600 has an activator system powerful enough to promote wetting on the most demanding substrate metallizations. The flux is a distinctive red color, which aids automated level-sensing equipment and also enhances visual inspection.
Features
- Flux rheology applicable for all sphere sizes
- Suitable for Pb-free or SnPb applications
- Uniform pin transfer over extended periods
- Red color for ease of detection
- Proven high yields in ball-attach process
- Excellent solderability on a wide range of surfaces
Introduction
Ball Attach Flux WS-3600 is a thixotropic flux designed for use in pin transfer applications for ball attachment to substrates (BGA manufacturing). Its rheology is specifically designed for use with even the smallest gravity-fed spheres. WS-3600 has an activator system powerful enough to promote wetting on the most demanding substrate metallizations. The flux is a distinctive red color, which aids automated level-sensing equipment and also enhances visual inspection.
