Fujipoly® America Corp. Two-Part Thermal Gap Filler SARCON® LG23A and LG30A

Description
The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to temperatures up to 100°. The mixed components cure into a flexible gel that is highly thermally conductive while exhibiting extremely low stress on delicate board components. Once cured the materials deliver a thermal conductivity of 2.3 and 3.0 W/m°K respectively.
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Datasheet
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The SARCON® LG23A and LG30A are two-part thermal gap fillers designed for applications requiring high thermal conductivity and electrical insulation. Both products cure into a flexible gel upon mixing, with LG23A offering a thermal conductivity of 2.3 W/m·K and LG30A providing 3.0 W/m·K, as measured by ASTM D5470. They are suitable for filling large and complex gaps between heat-generating components, ensuring efficient heat transfer.

The LG23A variant is characterized as a general-purpose type, while LG30A is noted for its higher thermal conductivity. Both products exhibit low stress on electronic components, making them ideal for sensitive applications. They can be cured at room temperature or accelerated with heat, with a pot life of approximately 60 minutes at 23°C. The materials maintain excellent properties under varying thermal conditions, with a temperature range of -40°C to +125°C.

These gap fillers are recommended for use in PCB heat spreaders and heaters, providing reliable performance in demanding environments.

Suppliers

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Two-Part Thermal Gap Filler - SARCON® LG23A and LG30A - Fujipoly® America Corp.
Carteret, NJ, United States
Two-Part Thermal Gap Filler
SARCON® LG23A and LG30A
Two-Part Thermal Gap Filler SARCON® LG23A and LG30A
The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to temperatures up to 100°. The mixed components cure into a flexible gel that is highly thermally conductive while exhibiting extremely low stress on delicate board components. Once cured the materials deliver a thermal conductivity of 2.3 and 3.0 W/m°K respectively.

The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance. SARCON® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to temperatures up to 100°. The mixed components cure into a flexible gel that is highly thermally conductive while exhibiting extremely low stress on delicate board components. Once cured the materials deliver a thermal conductivity of 2.3 and 3.0 W/m°K respectively.

Supplier's Site Datasheet

Technical Specifications

  Fujipoly® America Corp.
Product Category Industrial Sealants
Product Number SARCON® LG23A and LG30A
Product Name Two-Part Thermal Gap Filler
Cure / Technology Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Gel
Chemical System Silicone
Features High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive
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