Extreme Engineering Solutions, Inc. (X-ES) Dual XMC/PMC Carrier for Development and Testing XTend3103

Description
The XTend3103 is a dual XMC/PMC carrier card that offers a compact, low-cost development platform for XMC/PMC modules. In conjunction with a standard off-the-shelf ATX power supply, the XTend3103 provides a complete desktop or benchtop PCI/PCI-X XMC and PMC platform for development, evaluation, and testing, without the need for an expensive and bulky CompactPCI/VME PMC carrier card and chassis. The XTend3103 features four integrated 40 mm fans arranged in a push-pull configuration to provide ample airflow for even the most power-hungry modules (up to 50 W each). The XTend3103 also provides onboard +5 V, +3.3 V, and -12 V power supplies, sourcing only +12 V from the ATX power supply. This arrangement avoids the voltage drop and ampacity problems commonly associated with powering high-performance mezzanine modules using ATX supplies. Another common problem with XMC/PMC development is lack of early access to rear I/O ports. This is especially troublesome with conduction-cooled modules, which by design do not have Ethernet or serial access via front panel connectors. The XTend3103 solves this problem by providing a XIM/PIM (XMC/PMC I/O module) site for each XMC/PMC. These sites, when used in conjunction with the appropriate XIM/PIM, can provide the necessary I/O during the early development stage, when custom backplanes and wiring harnesses are often not available. Features Dual XMC sites capable of up to PCIe Express Gen3 Dual PCI/PCI-X PMC sites up to 133 MHz XMC sites support VITA 42 or VITA 61 connectors Each mezzanine site can be configured for Monarch or Root Complex functionality Dual XIM/PIM sites for XMC/PMC rear I/O Configurable voltage for XMC VPWR (+5 V or +12 V) and PMC VIO (+3.3 V or +5 V) ATX power supply connector Onboard +5 V, +3.3 V, and -12 V power supplies JTAG support Technical Specs PCI-X Dual 32/64-bit PCI/PCI-X sites up to 133 MHz Conventional PCI 33/66 MHz or PCI-X 66/100/133 MHz Auto PCI speed and mode detection Mezzanine I/O Two XIM/PIM sites for XMC/PMC rear I/O XMC XMC sites support per VITA 42 or VITA 61 connectors XMC 0 and XMC 1 can be configured as isolated or connected sites 100 MHz reference clock provided to each XMC site Cooling Four integrated 40 mm fans Push-pull airflow Power Supplies Onboard +5 V, +3.3 V, and -12 V supplies Supplies up to 100 W combined to XMC/PMC sites Only +12 V is sourced from ATX supply Power Requirements (from ATX supply) Power will vary based on configuration and usage. Please consult factory.
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Suppliers

Company
Product
Description
Supplier Links
Dual XMC/PMC Carrier for Development and Testing - XTend3103 - Extreme Engineering Solutions, Inc. (X-ES)
Verona, WI, United States
Dual XMC/PMC Carrier for Development and Testing
XTend3103
Dual XMC/PMC Carrier for Development and Testing XTend3103
The XTend3103 is a dual XMC/PMC carrier card that offers a compact, low-cost development platform for XMC/PMC modules. In conjunction with a standard off-the-shelf ATX power supply, the XTend3103 provides a complete desktop or benchtop PCI/PCI-X XMC and PMC platform for development, evaluation, and testing, without the need for an expensive and bulky CompactPCI/VME PMC carrier card and chassis. The XTend3103 features four integrated 40 mm fans arranged in a push-pull configuration to provide ample airflow for even the most power-hungry modules (up to 50 W each). The XTend3103 also provides onboard +5 V, +3.3 V, and -12 V power supplies, sourcing only +12 V from the ATX power supply. This arrangement avoids the voltage drop and ampacity problems commonly associated with powering high-performance mezzanine modules using ATX supplies. Another common problem with XMC/PMC development is lack of early access to rear I/O ports. This is especially troublesome with conduction-cooled modules, which by design do not have Ethernet or serial access via front panel connectors. The XTend3103 solves this problem by providing a XIM/PIM (XMC/PMC I/O module) site for each XMC/PMC. These sites, when used in conjunction with the appropriate XIM/PIM, can provide the necessary I/O during the early development stage, when custom backplanes and wiring harnesses are often not available. Features Dual XMC sites capable of up to PCIe Express Gen3 Dual PCI/PCI-X PMC sites up to 133 MHz XMC sites support VITA 42 or VITA 61 connectors Each mezzanine site can be configured for Monarch or Root Complex functionality Dual XIM/PIM sites for XMC/PMC rear I/O Configurable voltage for XMC VPWR (+5 V or +12 V) and PMC VIO (+3.3 V or +5 V) ATX power supply connector Onboard +5 V, +3.3 V, and -12 V power supplies JTAG support Technical Specs PCI-X Dual 32/64-bit PCI/PCI-X sites up to 133 MHz Conventional PCI 33/66 MHz or PCI-X 66/100/133 MHz Auto PCI speed and mode detection Mezzanine I/O Two XIM/PIM sites for XMC/PMC rear I/O XMC XMC sites support per VITA 42 or VITA 61 connectors XMC 0 and XMC 1 can be configured as isolated or connected sites 100 MHz reference clock provided to each XMC site Cooling Four integrated 40 mm fans Push-pull airflow Power Supplies Onboard +5 V, +3.3 V, and -12 V supplies Supplies up to 100 W combined to XMC/PMC sites Only +12 V is sourced from ATX supply Power Requirements (from ATX supply) Power will vary based on configuration and usage. Please consult factory.

The XTend3103 is a dual XMC/PMC carrier card that offers a compact, low-cost development platform for XMC/PMC modules. In conjunction with a standard off-the-shelf ATX power supply, the XTend3103 provides a complete desktop or benchtop PCI/PCI-X XMC and PMC platform for development, evaluation, and testing, without the need for an expensive and bulky CompactPCI/VME PMC carrier card and chassis.

The XTend3103 features four integrated 40 mm fans arranged in a push-pull configuration to provide ample airflow for even the most power-hungry modules (up to 50 W each). The XTend3103 also provides onboard +5 V, +3.3 V, and -12 V power supplies, sourcing only +12 V from the ATX power supply. This arrangement avoids the voltage drop and ampacity problems commonly associated with powering high-performance mezzanine modules using ATX supplies.

Another common problem with XMC/PMC development is lack of early access to rear I/O ports. This is especially troublesome with conduction-cooled modules, which by design do not have Ethernet or serial access via front panel connectors. The XTend3103 solves this problem by providing a XIM/PIM (XMC/PMC I/O module) site for each XMC/PMC. These sites, when used in conjunction with the appropriate XIM/PIM, can provide the necessary I/O during the early development stage, when custom backplanes and wiring harnesses are often not available.


Features

  • Dual XMC sites capable of up to PCIe Express Gen3
  • Dual PCI/PCI-X PMC sites up to 133 MHz
  • XMC sites support VITA 42 or VITA 61 connectors
  • Each mezzanine site can be configured for Monarch or Root Complex functionality
  • Dual XIM/PIM sites for XMC/PMC rear I/O
  • Configurable voltage for XMC VPWR (+5 V or +12 V) and PMC VIO (+3.3 V or +5 V)
  • ATX power supply connector
  • Onboard +5 V, +3.3 V, and -12 V power supplies
  • JTAG support

Technical Specs

PCI-X

  • Dual 32/64-bit PCI/PCI-X sites up to 133 MHz
  • Conventional PCI 33/66 MHz or PCI-X 66/100/133 MHz
  • Auto PCI speed and mode detection

Mezzanine I/O

  • Two XIM/PIM sites for XMC/PMC rear I/O

XMC

  • XMC sites support per VITA 42 or VITA 61 connectors
  • XMC 0 and XMC 1 can be configured as isolated or connected sites
  • 100 MHz reference clock provided to each XMC site

Cooling

  • Four integrated 40 mm fans
  • Push-pull airflow

Power Supplies

  • Onboard +5 V, +3.3 V, and -12 V supplies
  • Supplies up to 100 W combined to XMC/PMC sites
  • Only +12 V is sourced from ATX supply

Power Requirements (from ATX supply)

  • Power will vary based on configuration and usage. Please consult factory.
Supplier's Site Datasheet

Technical Specifications

  Extreme Engineering Solutions, Inc. (X-ES)
Product Category Industrial Chassis and Card Cages
Product Number XTend3103
Product Name Dual XMC/PMC Carrier for Development and Testing
Product Type Chassis
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