Extreme Engineering Solutions, Inc. (X-ES) Intel® Core™ Ultra Processor (Series 3)-Based 3U VPX-REDI Module with 64 GB of LPDDR5 and Microchip PolarFire™ SoC FPGA XPedite8371

The XPedite8371 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Core™ Ultra processor (Series 3) (formerly Panther Lake) and aligned to the Sensor Open System Architecture (SOSA) Payload profile (SLT3-PAY-1F1U1S1S1U 1U2F1H-14.6.11) for compute-intensive applications. Ideal for ruggedized systems requiring high-bandwidth processing and low power consumption, the XPedite8371 delivers superior performance and efficiency for today’s network information processing and high performance embedded computing applications. The XPedite8371 integrates SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The XPedite8371 supports up to 64 GB of LPDDR5 SDRAM with in-band ECC in eight channels and up to 512 GB of onboard NVMe storage. The XPedite8371 also provides fast and efficient I/O, with one 100GBASE-KR4 and two 25GBASE-KR Ethernet ports and including PCI Express through the backplane connectors. The XPedite8371 provides additional expansion capabilities by including an integrated XMC site, which includes a x4 PCI Express connection to the Intel® Core™ Ultra processor. Wind River VxWorks, X-ES Enterprise Linux (XEL), and Linux Yocto Board Support Packages (BSPs) are available. Features Supports Intel® Core™ Ultra processors (Series 3) (formerly Panther Lake) Designed with SecureCOTS™ technology to support enhanced security and trusted computing Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash Conduction- or air-cooled 3U VPX (VITA 46) module Compatible with multiple VITA 65 OpenVPX™ slot profiles Ruggedized Enhanced Design Implementation (REDI) per VITA 48 Up to 64 GB of LPDDR5 SDRAM with in-band ECC Up to 512 GB of NVMe storage One XMC site with x4 PCI Express Gen4-capable interface One 100GBASE-KR4 Ethernet port Two 25GBASE-KR Ethernet ports Two x4 PCI Express Gen4-capable interfaces Two maintenance serial ports, software configurable as LVCMOS or RS-232 RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support Supports SOSA Payload profile (SLT3-PAY-1F1U1S1S1U 1U2F1H-14.6.11) SOSA-aligned to AMPS Payload profile MODA3-16.6.11-1-0-F2 C-(E18-E15)(P4F-P4F) (E15)(G6-G2/G6)[N] > (compatibility with other profiles may be possible, contact factory for options) Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Linux Yocto BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Technical Specs Processor Supports Intel® Core™ Ultra processors (Series 3) (formerly Panther Lake) Memory Up to 64 GB of LPDDR5 SDRAM with in-band ECC Up to 512 GB of onboard NVMe storage 64 MB NOR boot flash 64 kB EEPROM Security and Management Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash Designed with SecureCOTS™ technology to support enhanced security and trusted computing System voltage monitor, power-on/reset control, non-volatile write-protection control Trusted Platform Module (TPM) 2.0 IPMI Controller (IPMC), supporting Tier 1, Tier 2, and Tier 3 operating modes VPX (VITA 46) P0 I/O Two IPMB connections to an IPMI Controller VPX (VITA 46) P1 I/O One 100GBASE-KR4 Ethernet port to P1.A Two 25GBASE-KR Ethernet ports Two x4 PCI Express Gen4-capable interfaces Two maintenance serial ports, software configurable as LVCMOS or RS-232 One FPGA LVDS pair One single-ended FPGA GPIO XMC Site One x4 PCI Express Gen4-capable interface Software Support RDMA over Converged Ethernet (RoCE) v2 internet layer protocol support UEFI firmware Wind River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Linux Yocto BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Physical Characteristics 3U VPX-REDI conduction- or air-cooled form factor Supports SOSA Payload profile (SLT3-PAY-1F1U1S1S1U 1U2F1H-14.6.11) SOSA-aligned to AMPS Payload profile MODA3-16.6.11-1-0-F2 C-(E18-E15)(P4F-P4F) (E15)(G6-G2/G6)[N] > (compatibility with other profiles may be possible, contact factory for options) Dimensions: 100 mm x 160 mm 1.0 in. pitch with Two-Level Maintenance (2LM) support Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Thermal performance will vary based on CPU frequency and application Contact X-ES for air-cooled development options Power Requirements Power will vary based on configuration and usage. Please consult factory.