The XPedite8300 is a secure, high-performance XMC single board computer based on the Intel® Core™ Ultra processor (Series 3) (formerly Panther Lake). Ideal for ruggedized systems requiring high-bandwidth processing and low power consumption, the XPedite8300 delivers superior performance and efficiency for today’s network information processing and high performance embedded computing applications.
The XPedite8300 integrates SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.
The XPedite8300 supports up to 64 GB of LPDDR5 SDRAM with in-band ECC in eight channels and up to 512 GB of onboard NVMe storage. The XPedite8300 also provides fast and efficient I/O, including 100GBASE-KR4 or 25GBASE-KR Ethernet, 10/100/1000BASE-T Ethernet, USB 2.0, PCI Express, I²C, and RS-232/422/485 serial ports.
Wind River VxWorks, X-ES Enterprise Linux (XEL), and Linux Yocto Board Support Packages (BSPs) are available.
Features
Supports Intel® Core™ Ultra processors (Series 3) (formerly Panther Lake)
Designed with SecureCOTS™ technology to support enhanced security and trusted computing
Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash
Conduction-cooled XMC module
Up to 64 GB of LPDDR5 SDRAM with in-band ECC
Up to 512 GB of onboard NVMe storage
One 100GBASE-KR4 Ethernet port or two 25GBASE-KR Ethernet ports
One 10/100/1000BASE-T Ethernet port
Two USB 2.0 ports
Two RS-232/422/485 serial ports
Two x1 and one x8 PCI Express Gen4-capable interfaces
One DisplayPort 1.4 interface
Wind River VxWorks BSP
X-ES Enterprise Linux (XEL) BSP
Linux Yocto BSP
Contact factory for availability of Microsoft Windows drivers and other operating systems
Technical Specs
Processor
Supports Intel® Core™ Ultra processors (Series 3) (formerly Panther Lake)
Memory
Up to 64 GB of LPDDR5 SDRAM with in-band ECC
Up to 512 GB of onboard NVMe storage
64 MB NOR boot flash
64 kB EEPROM
Security and Management
Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash
Designed with SecureCOTS™ technology to support enhanced security and trusted computing
System voltage monitor, power-on/reset control, non-volatile write-protection control
Trusted Platform Module (TPM) 2.0
P15 XMC Interface
One x8 PCI Express Gen4-capable interface
Four single-ended GPIO
P16 XMC Interface
One 100GBASE-KR4 Ethernet port or two 25GBASE-KR Ethernet ports
One 10/100/1000BASE-T Ethernet port
Two USB 2.0 ports
Two RS-232/422/485 serial ports
Two x1 PCI Express Gen4-capable interfaces
One DisplayPort 1.4 interface
One I²C port
3.3 V GPIO
Software Support
UEFI firmware
Wind River VxWorks BSP
X-ES Enterprise Linux (XEL) BSP
Linux Yocto BSP
Contact factory for availability of Microsoft Windows drivers and other operating systems
Physical Characteristics
Conduction-cooled XMC form factor
Dimensions: 149 mm x 74 mm, 10 mm stacking height
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
Conformal coating available as an ordering option
Power Requirements
Power will vary based on configuration and usage. Please consult factory.
The XPedite8300 is a secure, high-performance XMC single board computer based on the Intel® Core™ Ultra processor (Series 3) (formerly Panther Lake). Ideal for ruggedized systems requiring high-bandwidth processing and low power consumption, the XPedite8300 delivers superior performance and efficiency for today’s network information processing and high performance embedded computing applications.
The XPedite8300 integrates SecureCOTS™ technology with a Microchip PolarFire™ System-on-Chip (SoC) FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.
The XPedite8300 supports up to 64 GB of LPDDR5 SDRAM with in-band ECC in eight channels and up to 512 GB of onboard NVMe storage. The XPedite8300 also provides fast and efficient I/O, including 100GBASE-KR4 or 25GBASE-KR Ethernet, 10/100/1000BASE-T Ethernet, USB 2.0, PCI Express, I²C, and RS-232/422/485 serial ports.
Wind River VxWorks, X-ES Enterprise Linux (XEL), and Linux Yocto Board Support Packages (BSPs) are available.
Features
- Supports Intel® Core™ Ultra processors (Series 3) (formerly Panther Lake)
- Designed with SecureCOTS™ technology to support enhanced security and trusted computing
- Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash
- Conduction-cooled XMC module
- Up to 64 GB of LPDDR5 SDRAM with in-band ECC
- Up to 512 GB of onboard NVMe storage
- One 100GBASE-KR4 Ethernet port or two 25GBASE-KR Ethernet ports
- One 10/100/1000BASE-T Ethernet port
- Two USB 2.0 ports
- Two RS-232/422/485 serial ports
- Two x1 and one x8 PCI Express Gen4-capable interfaces
- One DisplayPort 1.4 interface
- Wind River VxWorks BSP
- X-ES Enterprise Linux (XEL) BSP
- Linux Yocto BSP
- Contact factory for availability of Microsoft Windows drivers and other operating systems
Technical Specs
Processor
- Supports Intel® Core™ Ultra processors (Series 3) (formerly Panther Lake)
Memory
- Up to 64 GB of LPDDR5 SDRAM with in-band ECC
- Up to 512 GB of onboard NVMe storage
- 64 MB NOR boot flash
- 64 kB EEPROM
Security and Management
- Microchip PolarFire™ SoC FPGA with 256 MB SPI NOR flash
- Designed with SecureCOTS™ technology to support enhanced security and trusted computing
- System voltage monitor, power-on/reset control, non-volatile write-protection control
- Trusted Platform Module (TPM) 2.0
P15 XMC Interface
- One x8 PCI Express Gen4-capable interface
- Four single-ended GPIO
P16 XMC Interface
- One 100GBASE-KR4 Ethernet port or two 25GBASE-KR Ethernet ports
- One 10/100/1000BASE-T Ethernet port
- Two USB 2.0 ports
- Two RS-232/422/485 serial ports
- Two x1 PCI Express Gen4-capable interfaces
- One DisplayPort 1.4 interface
- One I²C port
- 3.3 V GPIO
Software Support
- UEFI firmware
- Wind River VxWorks BSP
- X-ES Enterprise Linux (XEL) BSP
- Linux Yocto BSP
- Contact factory for availability of Microsoft Windows drivers and other operating systems
Physical Characteristics
- Conduction-cooled XMC form factor
- Dimensions: 149 mm x 74 mm, 10 mm stacking height
Environmental Requirements
Contact factory for appropriate board configuration based on environmental requirements.
- Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
- Conformal coating available as an ordering option
Power Requirements
- Power will vary based on configuration and usage. Please consult factory.