Extreme Engineering Solutions, Inc. (X-ES) NXP QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX Module XPedite5972

The XPedite5972 is a 3U OpenVPX™ REDI single board computer based on the NXP QorIQ T2080 processor. It is a design refresh of the XPedite5970, intended to update obsolete components while maintaining the same functionality and features. The XPedite5972 provides a rugged, feature-rich processing solution that maximizes the performance-per-watt capabilities of a Power Architecture®-based processor module. The T2080 processor offers eight virtual (four dual-threaded) e6500 cores, running at up to 1.8 GHz, and integrates a 128-bit AltiVec technology-based SIMD engine per core. The integrated AltiVec SIMD engines enable the XPedite5972 to support DSP-level Floating-Point performance and an extensive inventory of software libraries. The XPedite5972 also supports up to 8 GB of DDR3 ECC SDRAM and provides a plethora of I/O options to the backplane, including 10 Gigabit Ethernet, PCI Express Gen3, and Gen2 SRIO. The XPedite5972 provides superior growth and expansion capabilities by including an XMC or PMC site with full 10 mm I/O envelope support while maintaining a 0.8 in. VPX slot pitch, providing the system integrator with a wide variety of COTS options for additional I/O, storage, or processing while minimizing total system SWaP-C. Wind River VxWorks, Linux, Green Hills INTEGRITY, and DDC-I’s DO-178 Certifiable Deos Board Support Packages (BSPs) are available. Features NXP QorIQ T2080 processor with eight virtual Power Architecture® e6500 cores at up to 1.8 GHz 128-bit AltiVec technology-based SIMD engine Compatible with multiple VITA 65 OpenVPX™ slot profiles 3U VPX (VITA 46) module Ruggedized Enhanced Design Implementation (REDI) Conduction or air cooling Up to 8 GB of DDR3 ECC SDRAM Up to 512 MB of NOR flash (with redundancy) Up to 64 GB of NAND flash Hardware write protection for non-volatile memory XMC/PrPMC interface x4 PCI Express or Serial RapidIO or 10 GbE XAUI fabric Fat Pipe P1.A fabric interconnect x4 PCI Express or Serial RapidIO Fat Pipe P1.B fabric interconnect Two SerDes Gigabit Ethernet Thin Pipe P1 fabric interconnects Two 10/100/1000BASE-T Ethernet ports (optional) Two SATA ports to P2 or J16 (optional) Up to two RS-232/422/485 serial ports to P2 Two USB 2.0 ports to P2 (optionally, can route one port to front panel via plugover module) Front I/O available via plugover module Linux BSP Wind River VxWorks BSP Green Hills INTEGRITY BSP DDC-I's DO-178 Certifiable Deos BSP Technical Specs Processor NXP QorIQ T2080 processor Eight virtual (four dual-threaded) Power Architecture® e6500 cores at up to 1.8 GHz 2 MB L2 cache 512 kB platform cache IEEE 754 Floating-Point Unit (FPU) support 128-bit AltiVec technology-based SIMD engine Memory Up to 8 GB of DDR3 ECC SDRAM Up to 512 MB of NOR flash (with redundancy) Up to 64 GB of NAND flash XMC/PrPMC Site 32-bit, 66 MHz PCI bus (PMC interface) x4 PCI Express port (XMC interface) P64s P14 I/O support (optional) X12d P16 I/O support Front Panel I/O Front panel RJ-45 Ethernet, micro-DB-9 RS-232 serial ports, and USB 2.0 available via optional plugover module VPX (VITA 46) P0 I/O I²C port VPX (VITA 46) P1 I/O x4 PCI Express, Serial RapidIO or 10 GbE XAUI Fat Pipe to P1.A x4 PCI Express or Serial RapidIO Fat Pipe to P1.B Two SerDes Gigabit Ethernet ports (or one 10/100/1000BASE-T port to P1 and one 10/100/1000BASE-T port to P2) X12d XMC P16 I/O VPX (VITA 46) P2 I/O One 10/100/1000BASE-T port (when two SerDes Gigabit Ethernet P1 ports are not used) Two RS-232/422/485 serial ports Two USB 2.0 ports I²C port 3.3 V GPIO signals P64s PMC P14 I/O (optional) Two SATA ports capable of 6 Gb/s (optional) Software Support Wind River VxWorks BSP Linux BSP Green Hills INTEGRITY-178 BSP DDC-I's DO-178 Certifiable Deos BSP Contact factory for availability of QNX Neutrino and LynuxWorks LynxOS BSPs Physical Characteristics 3U VPX-REDI conduction- or air-cooled form factor Dimensions: 100 mm x 160 mm 0.8 in. pitch without solder-side cover 0.85 and 1.0 in. pitch with solder-side cover Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements. Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Contact X-ES for air-cooled development options Power Requirements Power will vary based on configuration and usage. Please consult factory.