Extreme Engineering Solutions, Inc. (X-ES) AMD (formerly Xilinx) Versal® Prime VM1402 ACAP-Based 3U VPX FPGA Module with 16 GB of LPDDR4, PCIe Gen3, and SecureCOTS™ XPedite2770

Description
The XPedite2770 is a high-performance, reconfigurable, conduction-cooled, 3U VPX processing module based on the AMD (formerly Xilinx) Versal® Prime Adaptive Compute Acceleration Platform (ACAP). With multiple high-speed fabric interfaces and 16 GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications. It integrates SecureCOTS™ technology with a Versal® Prime VM1402 ACAP for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The XPedite2770 is a heterogeneous compute platform that delivers exceptional performance utilizing two ARM® Cortex®-A72 processor cores, two ARM® Cortex®-R5F real-time processor cores, a Network-on-Chip (NoC) interconnect, and a large FPGA fabric. These devices provide specialized processing elements designed to meet the demands of high-bandwidth applications such as packet processing, signal processing, sensor I/O, DSP-intensive applications, next-generation wired and 5G wireless infrastructure, cloud computing, and aerospace and defense applications. Providing incredible speed with two x4 and two x1 High-Speed Serial (HSS) 25 Gbps-capable interfaces, plus two 1000BASE-T Ethernet ports, the XPedite2770 accommodates up to 256 GB of onboard NAND flash in addition to numerous I/O ports, including LVDS, single-ended GPIO, and RS-232/422/485 serial through the backplane connectors. The XPedite2770 provides additional expansion capabilities by including an integrated XMC site, which includes one x8 HSS 16 Gbps-capable connection to the Versal® Prime ACAP and X12d I/O mapped directly to the VPX backplane connectors. Additional configurations can route x16s and x8d from the XMC site to the VPX backplane connectors. The XPedite2770 offers a SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T 1U1T-14.2.16 and is designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C- (P3F)(P2F)(2E7-E3)(N -N-N-N-M3/M4/M5-N) A0>. The XPedite2770 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES Hardware Manager Development Kit (HMDK) is provided to deliver a pre-validated environment for rapid application development, offering an optimized library of IP, design resources, and software components that can easily be used as the basis for custom designs. X-ES’ HMDK includes the Hardware Manager application, Arm Trusted Firmware (ATF), U-Boot bootloader, and the FPGA Development Kit (FDK), and complete example designs for the XPedite2770. Linux Yocto support is also available separately. Features AMD (formerly Xilinx) Versal® Prime VM1402 ACAP 3U VPX (VITA 46) module Compatible with multiple VITA 65 OpenVPX™ slot profiles and SOSA-aligned options 16 GB of LPDDR4 ECC SDRAM in two channels Option to reconfigure one channel as 16 GB non-ECC SDRAM for higher performance and capacity (24 GB total) 4 Gbit of QSPI FPGA configuration flash Up to 256 GB of NAND flash XMC site with one x8 High-Speed Serial (HSS) 16 Gbps-capable interface to support PCI Express Two x1 HSS 25 Gbps-capable interfaces to support 25 Gigabit Ethernet Two x4 HSS 25 Gbps-capable interfaces to support Ethernet, CPM, PCI Express, etc. Interfaces on P1.A and P1.B can be combined to function as one x8 CPM PCI Express interface One x1 HSS 8 Gbps-capable capable interface to support storage Two 1000BASE-T Ethernet ports One RS-232/422/485 serial port One UART/RS-232 maintenance port 14 LVDS GPIO (XPIO) 16 single-ended GPIO (HDIO), three single-ended GPIO (MIO) SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T 1U1T-14.2.16 Designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C- (P3F)(P2F)(2E7-E3)(N -N-N-N-M3/M4/M5-N) A0> Linux Yocto support Hardware Manager Development Kit (HMDK) Technical Specs FPGA AMD (formerly Xilinx) Versal® Prime VM1402 ACAP for high-performance logic and DSP applications Dual-core ARM® Cortex®-A72, 48 KB/32 KB L1 cache with parity and ECC; 1 MB L2 cache with ECC Dual-core ARM® Cortex®-R5F, 32 KB/32 KB L1 cache, and 256 KB TCM with ECC One coherent PCI Express module (CPM) to support PCIe with acceleration features such as CCIX Two integrated MRMAC blocks supporting 100 Gigabit-capable Ethernet functions Two integrated PLPCIe Gen4 blocks supporting PCI Express functions Memory 16 GB of LPDDR4 ECC SDRAM in two channels One channel can be reconfigured as 16 GB non-ECC SDRAM for higher performance and capacity (24 GB total) Up to 256 GB of NAND flash 4 Gbit of QSPI FPGA configuration flash XMC Site One x8 High-Speed Serial (HSS) 16 Gbps-capable interface to support PCI Express VPX (VITA 46) P0 I/O Two IPMB connections to an IPMI controller VPX (VITA 46) P1 I/O Two x1 HSS 25 Gbps-capable interfaces to support 25GBASE-R Ethernet One x4 HSS 25 Gbps-capable interface on P1.A to support Ethernet, CPM, PCIe, etc. One x4 HSS 25 Gbps-capable interface on P1.B to support Ethernet, PCIe, etc. P1.A and P1.B ports can be combined to function as one x8 CPM PCI Express port XMC P16 I/O, mapping P1w9-X12d per VITA 46.9 VPX (VITA 46) P2 I/O Two 1000BASE-T Ethernet ports Build option for six LVDS GPIO (XPIO) One x1 HSS 8 Gbps-capable interface to support PCIe and SATA One RS-232/422/485 serial port Build option for eight LVDS (XPIO) and 16 single-ended GPIO (HDIO) from the FPGA, or XMC P16 I/O mapping P2w9-X16s+X8d Three single-ended GPIO (MIO) Development Support Linux Yocto support Hardware Manager Development Kit (HMDK) Physical Characteristics 3U VPX-REDI conduction- or air-cooled form factor SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T 1U1T-14.2.16 Designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C- (P3F)(P2F)(2E7-E3)(N -N-N-N-M3/M4/M5-N) A0> Dimensions: 100 mm x 160 mm 0.8 in. pitch without solder-side cover 0.85 in. and 1.0 in. pitch with solder-side cover and Two-Level Maintenance (2LM) support Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements. Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Power Requirements Power will vary based on configuration and usage. Please consult factory.
  • AMD (formerly Xilinx) Versal® Prime VM1402 ACAP-Based 3U VPX FPGA Module with 16 GB of LPDDR4, PCIe Gen3, and SecureCOTS™ - XPedite2770 - Extreme Engineering Solutions, Inc. (X-ES)
    Extreme Engineering Solutions, Inc. (X-ES)
Datasheet
Description
The XPedite2770 is a high-performance, reconfigurable, conduction-cooled, 3U VPX processing module based on the AMD (formerly Xilinx) Versal® Prime Adaptive Compute Acceleration Platform (ACAP). With multiple high-speed fabric interfaces and 16 GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications. It integrates SecureCOTS™ technology with a Versal® Prime VM1402 ACAP for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The XPedite2770 is a heterogeneous compute platform that delivers exceptional performance utilizing two ARM® Cortex®-A72 processor cores, two ARM® Cortex®-R5F real-time processor cores, a Network-on-Chip (NoC) interconnect, and a large FPGA fabric. These devices provide specialized processing elements designed to meet the demands of high-bandwidth applications such as packet processing, signal processing, sensor I/O, DSP-intensive applications, next-generation wired and 5G wireless infrastructure, cloud computing, and aerospace and defense applications. Providing incredible speed with two x4 and two x1 High-Speed Serial (HSS) 25 Gbps-capable interfaces, plus two 1000BASE-T Ethernet ports, the XPedite2770 accommodates up to 256 GB of onboard NAND flash in addition to numerous I/O ports, including LVDS, single-ended GPIO, and RS-232/422/485 serial through the backplane connectors. The XPedite2770 provides additional expansion capabilities by including an integrated XMC site, which includes one x8 HSS 16 Gbps-capable connection to the Versal® Prime ACAP and X12d I/O mapped directly to the VPX backplane connectors. Additional configurations can route x16s and x8d from the XMC site to the VPX backplane connectors. The XPedite2770 offers a SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T 1U1T-14.2.16 and is designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C- (P3F)(P2F)(2E7-E3)(N -N-N-N-M3/M4/M5-N) A0>. The XPedite2770 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES Hardware Manager Development Kit (HMDK) is provided to deliver a pre-validated environment for rapid application development, offering an optimized library of IP, design resources, and software components that can easily be used as the basis for custom designs. X-ES’ HMDK includes the Hardware Manager application, Arm Trusted Firmware (ATF), U-Boot bootloader, and the FPGA Development Kit (FDK), and complete example designs for the XPedite2770. Linux Yocto support is also available separately. Features AMD (formerly Xilinx) Versal® Prime VM1402 ACAP 3U VPX (VITA 46) module Compatible with multiple VITA 65 OpenVPX™ slot profiles and SOSA-aligned options 16 GB of LPDDR4 ECC SDRAM in two channels Option to reconfigure one channel as 16 GB non-ECC SDRAM for higher performance and capacity (24 GB total) 4 Gbit of QSPI FPGA configuration flash Up to 256 GB of NAND flash XMC site with one x8 High-Speed Serial (HSS) 16 Gbps-capable interface to support PCI Express Two x1 HSS 25 Gbps-capable interfaces to support 25 Gigabit Ethernet Two x4 HSS 25 Gbps-capable interfaces to support Ethernet, CPM, PCI Express, etc. Interfaces on P1.A and P1.B can be combined to function as one x8 CPM PCI Express interface One x1 HSS 8 Gbps-capable capable interface to support storage Two 1000BASE-T Ethernet ports One RS-232/422/485 serial port One UART/RS-232 maintenance port 14 LVDS GPIO (XPIO) 16 single-ended GPIO (HDIO), three single-ended GPIO (MIO) SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T 1U1T-14.2.16 Designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C- (P3F)(P2F)(2E7-E3)(N -N-N-N-M3/M4/M5-N) A0> Linux Yocto support Hardware Manager Development Kit (HMDK) Technical Specs FPGA AMD (formerly Xilinx) Versal® Prime VM1402 ACAP for high-performance logic and DSP applications Dual-core ARM® Cortex®-A72, 48 KB/32 KB L1 cache with parity and ECC; 1 MB L2 cache with ECC Dual-core ARM® Cortex®-R5F, 32 KB/32 KB L1 cache, and 256 KB TCM with ECC One coherent PCI Express module (CPM) to support PCIe with acceleration features such as CCIX Two integrated MRMAC blocks supporting 100 Gigabit-capable Ethernet functions Two integrated PLPCIe Gen4 blocks supporting PCI Express functions Memory 16 GB of LPDDR4 ECC SDRAM in two channels One channel can be reconfigured as 16 GB non-ECC SDRAM for higher performance and capacity (24 GB total) Up to 256 GB of NAND flash 4 Gbit of QSPI FPGA configuration flash XMC Site One x8 High-Speed Serial (HSS) 16 Gbps-capable interface to support PCI Express VPX (VITA 46) P0 I/O Two IPMB connections to an IPMI controller VPX (VITA 46) P1 I/O Two x1 HSS 25 Gbps-capable interfaces to support 25GBASE-R Ethernet One x4 HSS 25 Gbps-capable interface on P1.A to support Ethernet, CPM, PCIe, etc. One x4 HSS 25 Gbps-capable interface on P1.B to support Ethernet, PCIe, etc. P1.A and P1.B ports can be combined to function as one x8 CPM PCI Express port XMC P16 I/O, mapping P1w9-X12d per VITA 46.9 VPX (VITA 46) P2 I/O Two 1000BASE-T Ethernet ports Build option for six LVDS GPIO (XPIO) One x1 HSS 8 Gbps-capable interface to support PCIe and SATA One RS-232/422/485 serial port Build option for eight LVDS (XPIO) and 16 single-ended GPIO (HDIO) from the FPGA, or XMC P16 I/O mapping P2w9-X16s+X8d Three single-ended GPIO (MIO) Development Support Linux Yocto support Hardware Manager Development Kit (HMDK) Physical Characteristics 3U VPX-REDI conduction- or air-cooled form factor SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T 1U1T-14.2.16 Designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C- (P3F)(P2F)(2E7-E3)(N -N-N-N-M3/M4/M5-N) A0> Dimensions: 100 mm x 160 mm 0.8 in. pitch without solder-side cover 0.85 in. and 1.0 in. pitch with solder-side cover and Two-Level Maintenance (2LM) support Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements. Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Power Requirements Power will vary based on configuration and usage. Please consult factory.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
AMD (formerly Xilinx) Versal® Prime VM1402 ACAP-Based 3U VPX FPGA Module with 16 GB of LPDDR4, PCIe Gen3, and SecureCOTS™ - XPedite2770 - Extreme Engineering Solutions, Inc. (X-ES)
Extreme Engineering Solutions, Inc. (X-ES)
Verona, WI, United States
AMD (formerly Xilinx) Versal® Prime VM1402 ACAP-Based 3U VPX FPGA Module with 16 GB of LPDDR4, PCIe Gen3, and SecureCOTS™
XPedite2770
AMD (formerly Xilinx) Versal® Prime VM1402 ACAP-Based 3U VPX FPGA Module with 16 GB of LPDDR4, PCIe Gen3, and SecureCOTS™ XPedite2770
The XPedite2770 is a high-performance, reconfigurable, conduction-cooled, 3U VPX processing module based on the AMD (formerly Xilinx) Versal® Prime Adaptive Compute Acceleration Platform (ACAP). With multiple high-speed fabric interfaces and 16 GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications. It integrates SecureCOTS™ technology with a Versal® Prime VM1402 ACAP for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. The XPedite2770 is a heterogeneous compute platform that delivers exceptional performance utilizing two ARM® Cortex®-A72 processor cores, two ARM® Cortex®-R5F real-time processor cores, a Network-on-Chip (NoC) interconnect, and a large FPGA fabric. These devices provide specialized processing elements designed to meet the demands of high-bandwidth applications such as packet processing, signal processing, sensor I/O, DSP-intensive applications, next-generation wired and 5G wireless infrastructure, cloud computing, and aerospace and defense applications. Providing incredible speed with two x4 and two x1 High-Speed Serial (HSS) 25 Gbps-capable interfaces, plus two 1000BASE-T Ethernet ports, the XPedite2770 accommodates up to 256 GB of onboard NAND flash in addition to numerous I/O ports, including LVDS, single-ended GPIO, and RS-232/422/485 serial through the backplane connectors. The XPedite2770 provides additional expansion capabilities by including an integrated XMC site, which includes one x8 HSS 16 Gbps-capable connection to the Versal® Prime ACAP and X12d I/O mapped directly to the VPX backplane connectors. Additional configurations can route x16s and x8d from the XMC site to the VPX backplane connectors. The XPedite2770 offers a SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T 1U1T-14.2.16 and is designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C- (P3F)(P2F)(2E7-E3)(N -N-N-N-M3/M4/M5-N) A0>. The XPedite2770 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES Hardware Manager Development Kit (HMDK) is provided to deliver a pre-validated environment for rapid application development, offering an optimized library of IP, design resources, and software components that can easily be used as the basis for custom designs. X-ES’ HMDK includes the Hardware Manager application, Arm Trusted Firmware (ATF), U-Boot bootloader, and the FPGA Development Kit (FDK), and complete example designs for the XPedite2770. Linux Yocto support is also available separately. Features AMD (formerly Xilinx) Versal® Prime VM1402 ACAP 3U VPX (VITA 46) module Compatible with multiple VITA 65 OpenVPX™ slot profiles and SOSA-aligned options 16 GB of LPDDR4 ECC SDRAM in two channels Option to reconfigure one channel as 16 GB non-ECC SDRAM for higher performance and capacity (24 GB total) 4 Gbit of QSPI FPGA configuration flash Up to 256 GB of NAND flash XMC site with one x8 High-Speed Serial (HSS) 16 Gbps-capable interface to support PCI Express Two x1 HSS 25 Gbps-capable interfaces to support 25 Gigabit Ethernet Two x4 HSS 25 Gbps-capable interfaces to support Ethernet, CPM, PCI Express, etc. Interfaces on P1.A and P1.B can be combined to function as one x8 CPM PCI Express interface One x1 HSS 8 Gbps-capable capable interface to support storage Two 1000BASE-T Ethernet ports One RS-232/422/485 serial port One UART/RS-232 maintenance port 14 LVDS GPIO (XPIO) 16 single-ended GPIO (HDIO), three single-ended GPIO (MIO) SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T 1U1T-14.2.16 Designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C- (P3F)(P2F)(2E7-E3)(N -N-N-N-M3/M4/M5-N) A0> Linux Yocto support Hardware Manager Development Kit (HMDK) Technical Specs FPGA AMD (formerly Xilinx) Versal® Prime VM1402 ACAP for high-performance logic and DSP applications Dual-core ARM® Cortex®-A72, 48 KB/32 KB L1 cache with parity and ECC; 1 MB L2 cache with ECC Dual-core ARM® Cortex®-R5F, 32 KB/32 KB L1 cache, and 256 KB TCM with ECC One coherent PCI Express module (CPM) to support PCIe with acceleration features such as CCIX Two integrated MRMAC blocks supporting 100 Gigabit-capable Ethernet functions Two integrated PLPCIe Gen4 blocks supporting PCI Express functions Memory 16 GB of LPDDR4 ECC SDRAM in two channels One channel can be reconfigured as 16 GB non-ECC SDRAM for higher performance and capacity (24 GB total) Up to 256 GB of NAND flash 4 Gbit of QSPI FPGA configuration flash XMC Site One x8 High-Speed Serial (HSS) 16 Gbps-capable interface to support PCI Express VPX (VITA 46) P0 I/O Two IPMB connections to an IPMI controller VPX (VITA 46) P1 I/O Two x1 HSS 25 Gbps-capable interfaces to support 25GBASE-R Ethernet One x4 HSS 25 Gbps-capable interface on P1.A to support Ethernet, CPM, PCIe, etc. One x4 HSS 25 Gbps-capable interface on P1.B to support Ethernet, PCIe, etc. P1.A and P1.B ports can be combined to function as one x8 CPM PCI Express port XMC P16 I/O, mapping P1w9-X12d per VITA 46.9 VPX (VITA 46) P2 I/O Two 1000BASE-T Ethernet ports Build option for six LVDS GPIO (XPIO) One x1 HSS 8 Gbps-capable interface to support PCIe and SATA One RS-232/422/485 serial port Build option for eight LVDS (XPIO) and 16 single-ended GPIO (HDIO) from the FPGA, or XMC P16 I/O mapping P2w9-X16s+X8d Three single-ended GPIO (MIO) Development Support Linux Yocto support Hardware Manager Development Kit (HMDK) Physical Characteristics 3U VPX-REDI conduction- or air-cooled form factor SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T 1U1T-14.2.16 Designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C- (P3F)(P2F)(2E7-E3)(N -N-N-N-M3/M4/M5-N) A0> Dimensions: 100 mm x 160 mm 0.8 in. pitch without solder-side cover 0.85 in. and 1.0 in. pitch with solder-side cover and Two-Level Maintenance (2LM) support Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements. Supported ruggedization levels (see the X-ES Ruggedization Chart): 5 Conformal coating available as an ordering option Power Requirements Power will vary based on configuration and usage. Please consult factory.

The XPedite2770 is a high-performance, reconfigurable, conduction-cooled, 3U VPX processing module based on the AMD (formerly Xilinx) Versal® Prime Adaptive Compute Acceleration Platform (ACAP). With multiple high-speed fabric interfaces and 16 GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications. It integrates SecureCOTS™ technology with a Versal® Prime VM1402 ACAP for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required.

The XPedite2770 is a heterogeneous compute platform that delivers exceptional performance utilizing two ARM® Cortex®-A72 processor cores, two ARM® Cortex®-R5F real-time processor cores, a Network-on-Chip (NoC) interconnect, and a large FPGA fabric. These devices provide specialized processing elements designed to meet the demands of high-bandwidth applications such as packet processing, signal processing, sensor I/O, DSP-intensive applications, next-generation wired and 5G wireless infrastructure, cloud computing, and aerospace and defense applications.

Providing incredible speed with two x4 and two x1 High-Speed Serial (HSS) 25 Gbps-capable interfaces, plus two 1000BASE-T Ethernet ports, the XPedite2770 accommodates up to 256 GB of onboard NAND flash in addition to numerous I/O ports, including LVDS, single-ended GPIO, and RS-232/422/485 serial through the backplane connectors. The XPedite2770 provides additional expansion capabilities by including an integrated XMC site, which includes one x8 HSS 16 Gbps-capable connection to the Versal® Prime ACAP and X12d I/O mapped directly to the VPX backplane connectors. Additional configurations can route x16s and x8d from the XMC site to the VPX backplane connectors.

The XPedite2770 offers a SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16 and is designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)<XA0>.

The XPedite2770 provides a high-performance, feature-rich solution capable of interfacing to and processing streaming data from a wide variety of sensors. The X-ES Hardware Manager Development Kit (HMDK) is provided to deliver a pre-validated environment for rapid application development, offering an optimized library of IP, design resources, and software components that can easily be used as the basis for custom designs. X-ES’ HMDK includes the Hardware Manager application, Arm Trusted Firmware (ATF), U-Boot bootloader, and the FPGA Development Kit (FDK), and complete example designs for the XPedite2770. Linux Yocto support is also available separately.


Features

  • AMD (formerly Xilinx) Versal® Prime VM1402 ACAP
  • 3U VPX (VITA 46) module
  • Compatible with multiple VITA 65 OpenVPX™ slot profiles and SOSA-aligned options
  • 16 GB of LPDDR4 ECC SDRAM in two channels
  • Option to reconfigure one channel as 16 GB non-ECC SDRAM for higher performance and capacity (24 GB total)
  • 4 Gbit of QSPI FPGA configuration flash
  • Up to 256 GB of NAND flash
  • XMC site with one x8 High-Speed Serial (HSS) 16 Gbps-capable interface to support PCI Express
  • Two x1 HSS 25 Gbps-capable interfaces to support 25 Gigabit Ethernet
  • Two x4 HSS 25 Gbps-capable interfaces to support Ethernet, CPM, PCI Express, etc.
  • Interfaces on P1.A and P1.B can be combined to function as one x8 CPM PCI Express interface
  • One x1 HSS 8 Gbps-capable capable interface to support storage
  • Two 1000BASE-T Ethernet ports
  • One RS-232/422/485 serial port
  • One UART/RS-232 maintenance port
  • 14 LVDS GPIO (XPIO)
  • 16 single-ended GPIO (HDIO), three single-ended GPIO (MIO)
  • SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16
  • Designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)<XA0>
  • Linux Yocto support
  • Hardware Manager Development Kit (HMDK)

Technical Specs

FPGA

  • AMD (formerly Xilinx) Versal® Prime VM1402 ACAP for high-performance logic and DSP applications
  • Dual-core ARM® Cortex®-A72, 48 KB/32 KB L1 cache with parity and ECC; 1 MB L2 cache with ECC
  • Dual-core ARM® Cortex®-R5F, 32 KB/32 KB L1 cache, and 256 KB TCM with ECC
  • One coherent PCI Express module (CPM) to support PCIe with acceleration features such as CCIX
  • Two integrated MRMAC blocks supporting 100 Gigabit-capable Ethernet functions
  • Two integrated PLPCIe Gen4 blocks supporting PCI Express functions

Memory

  • 16 GB of LPDDR4 ECC SDRAM in two channels
  • One channel can be reconfigured as 16 GB non-ECC SDRAM for higher performance and capacity (24 GB total)
  • Up to 256 GB of NAND flash
  • 4 Gbit of QSPI FPGA configuration flash

XMC Site

  • One x8 High-Speed Serial (HSS) 16 Gbps-capable interface to support PCI Express

VPX (VITA 46) P0 I/O

  • Two IPMB connections to an IPMI controller

VPX (VITA 46) P1 I/O

  • Two x1 HSS 25 Gbps-capable interfaces to support 25GBASE-R Ethernet
  • One x4 HSS 25 Gbps-capable interface on P1.A to support Ethernet, CPM, PCIe, etc.
  • One x4 HSS 25 Gbps-capable interface on P1.B to support Ethernet, PCIe, etc.
  • P1.A and P1.B ports can be combined to function as one x8 CPM PCI Express port
  • XMC P16 I/O, mapping P1w9-X12d per VITA 46.9

VPX (VITA 46) P2 I/O

  • Two 1000BASE-T Ethernet ports
  • Build option for six LVDS GPIO (XPIO)
  • One x1 HSS 8 Gbps-capable interface to support PCIe and SATA
  • One RS-232/422/485 serial port
  • Build option for eight LVDS (XPIO) and 16 single-ended GPIO (HDIO) from the FPGA, or XMC P16 I/O mapping P2w9-X16s+X8d
  • Three single-ended GPIO (MIO)

Development Support

  • Linux Yocto support
  • Hardware Manager Development Kit (HMDK)

Physical Characteristics

  • 3U VPX-REDI conduction- or air-cooled form factor
  • SOSA-aligned pinout compatible with backplane slot profile SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16
  • Designed with support for SOSA-aligned AMPS profile MODA3-16.2.15-1-F2C-(P3F)(P2F)(2E7-E3)(N-N-N-N-M3/M4/M5-N)<XA0>
  • Dimensions: 100 mm x 160 mm
  • 0.8 in. pitch without solder-side cover
  • 0.85 in. and 1.0 in. pitch with solder-side cover and Two-Level Maintenance (2LM) support

Environmental Requirements

Contact factory for appropriate board configuration based on environmental requirements.

  • Supported ruggedization levels (see the X-ES Ruggedization Chart): 5
  • Conformal coating available as an ordering option

Power Requirements

  • Power will vary based on configuration and usage. Please consult factory.
Supplier's Site Datasheet

Technical Specifications

  Extreme Engineering Solutions, Inc. (X-ES)
Product Category VME, VPX, and VXI Bus Interfaces and Adapters
Product Number XPedite2770
Product Name AMD (formerly Xilinx) Versal® Prime VM1402 ACAP-Based 3U VPX FPGA Module with 16 GB of LPDDR4, PCIe Gen3, and SecureCOTS™
Technology VPX
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