RS Components, Ltd. 547253

Activated No-Clean solder alloy with incorporated resinous flux. Designed for industrial applications in the electronics and connector industries. Excellent wetting on tin-plated substrates. Generates minimal fumes and residue. Chlorine content: 1.1 %. Class: J-STD-004 ROM1 Wire Diameter = 1.2mm Percent Lead = 40% Product Form = Wire Melting Point = +183 - +190°C Percent Tin = 60% Flux Type = Rosin Product Weight = 500g Flux Content Percent = 2.6%