Ebara's GCR abatement systems cleanly and efficiently remove carbon monoxide and PFC gases from ashing and oxide etch semiconductor waste streams. The standard GCR model targets CO gases using a high temperature oxidation path. PFC's such as CF4 are decomposed using an optional metal catalyst substrate. High destruction efficiency is accomplished by maximizing the gas residence time inside the high temperature reactor. Two GCR sizes are available to handle a variety of gas loads:
| EBARA Technologies, Inc. | |
|---|---|
| Product Category | Thin Film Equipment |
| Product Number | GCR Abatement System |
| Type | Free Standing System |
