DuPont Electronics & Imaging Copper Clad Laminate and Bonding Film System Pyralux® TK

DuPont™ Pyralux® TK is a fluoropolymer/polyim ide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications. Specifically formulated with FEP fluoropolymer film and DuPont™ Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. Its use in flex interconnect applications provide exceptional electrical performance. Copper Clad Features: Certified to IPC 4203A/13 Available in dielectric thicknesses of 2, 3, and 4 mils Available in copper thicknesses of 12, 18 and 35 microns Available in copper types RA, ED Bondply DuPont™ Pyralux® TK bondply composites are constructed of DuPont™ Kapton® polyimide film coated on both sides with a fluoropolymer adhesive. Bondply is used to encapsulate two etched details for environmental protection and electrical insulation. Using bondply can eliminate a layer of Kapton® and a layer of adhesive in low count multilayer constructions. Bondply Features: No tack for ease of registration Excellent encapsulation ability Available in thicknesses of 3, 4, and 5.5 mils Certified to IPC 4203A/5