DuPont Electronics & Imaging All Polyimide High Temperature Bonding Film Pyralux® HT

DuPont™ Pyralux® HT bonding film can be used in conjunction with Pyralux® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after processing. Pyralux® HT can be used as a coverfilm, offering good coverage over circuits, or as a bonding material for multilayer flex applications. This material system is ideal for multilayer flex and rigid flex applications which require high operating temperature performance, advanced material performance, and high reliability System Features: >225°C IPC service temperature Excellent thermal resistance UL 94V-0 Low loss characteristics Excellent punching and drilling performance Excellent dielectric thickness tolerance/electrical performance High adhesion Halogen-free Low outgassing Bonding Film Features: Able to withstand multiple lamination cycles without degradation Excellent encapsulation and conformation over circuitry Low resin flow No refrigeration required for storage Construction: Available in thicknesses of 1.5, 2.0, and 3.0 mils Certifications: Certified to IPC 4203A/24 UL 94V-0