DuPont Electronics & Imaging All Polyimide Single Sided Copper Clad Laminate Pyralux® AC

Description
DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment. Features Excellent dimensional stability (-0.02%, as received) Low moisture absorption (<1%) High modulus for reliable COF wire bonding Excellent thermal resistance Construction Copper thickness: 9, 12, 18, 35um PI thickness: 12, 20, 25, 45um Copper type: compatible with both ED and RA coppers Available in roll widths of 250, 500, and 610 millimeters Certification UL94 V-0 flammability rating Certified to IPC 4204/25 UL maximum operating temperature (MOT) 155C
Datasheet
Description
DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment. Features Excellent dimensional stability (-0.02%, as received) Low moisture absorption (<1%) High modulus for reliable COF wire bonding Excellent thermal resistance Construction Copper thickness: 9, 12, 18, 35um PI thickness: 12, 20, 25, 45um Copper type: compatible with both ED and RA coppers Available in roll widths of 250, 500, and 610 millimeters Certification UL94 V-0 flammability rating Certified to IPC 4204/25 UL maximum operating temperature (MOT) 155C
Datasheet

Suppliers

Company
Product
Description
Supplier Links
All Polyimide Single Sided Copper Clad Laminate - Pyralux® AC - DuPont Electronics & Imaging
Research Triangle Park, NC, United States
All Polyimide Single Sided Copper Clad Laminate
Pyralux® AC
All Polyimide Single Sided Copper Clad Laminate Pyralux® AC
DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment. Features Excellent dimensional stability (-0.02%, as received) Low moisture absorption (<1%) High modulus for reliable COF wire bonding Excellent thermal resistance Construction Copper thickness: 9, 12, 18, 35um PI thickness: 12, 20, 25, 45um Copper type: compatible with both ED and RA coppers Available in roll widths of 250, 500, and 610 millimeters Certification UL94 V-0 flammability rating Certified to IPC 4204/25 UL maximum operating temperature (MOT) 155C

DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment.

Features

  • Excellent dimensional stability (-0.02%, as received)
  • Low moisture absorption (<1%)
  • High modulus for reliable COF wire bonding
  • Excellent thermal resistance

Construction

  • Copper thickness: 9, 12, 18, 35um
  • PI thickness: 12, 20, 25, 45um
  • Copper type: compatible with both ED and RA coppers
  • Available in roll widths of 250, 500, and 610 millimeters

Certification

  • UL94 V-0 flammability rating
  • Certified to IPC 4204/25
  • UL maximum operating temperature (MOT) 155C
Supplier's Site Datasheet

Technical Specifications

  DuPont Electronics & Imaging
Product Category RF and Microwave Laminates
Product Number Pyralux® AC
Product Name All Polyimide Single Sided Copper Clad Laminate
Materials Polyimide (e.g., Kapton®); Plastic / Polymer
Application RF / Microwave
Features IPC; UL Listed
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