Interra® HK04M embedded capacitance laminate is used between the power and ground planes within a multilayer printed wiring board.
Interra® HK04M provides very low impedance at high frequency, power bus decoupling, and electromagnetic interference reduction. It replaces surface mount by-pass capacitors and their plated-through-holes
, which improves the reliability, design flexibility, packaging size and cost of the PWB.
Interra® HK04M is an all-polyimide dielectric laminate that offers the best mechanical properties, reliability and capacitance stability on the market. It can be processed as a thin flexible circuit laminate through the develop/etch/strip process steps. The HK04M dielectric is flexible and can be imaged and etched to remove copper on both sides of the dielectric at the same time.
Applications
High speed multilayer printed wiring boards
Servers, routers, telecom
Backpanels
Military and Aerospace PWBs
Graphics Processing Units (GPU)
PWB's with >4 SMT By-Pass Capacitors per square inch
Benefits of Embedded Capacitance
Cost reduction by reducing surface mount capacitors and their plated-through-holes
Reduced inductance for efficient low noise power delivery
Reduced board size and layer count
Improved circuit design
Improved PWB reliability and toughness
Higher processing yield
Features of Interra® HK04M
Modified polyimide core to handle thinner dielectric layer (12 μm and less)
Homogeneous, all-polyimide dielectric layer that will not delaminate during processing
High initiation and propagation tear strengths contribute to superior handling
Proven high reliability under extreme conditions
Excellent capacitance stability over range of frequencies, temperatures and voltages
Constructions
Available with ½ oz (18 μm), 1 oz (35 μm) and 2 oz (70 μm) copper thicknesses in balanced and unbalanced constructions
Offered with IPC 4562 Grade 3 reverse treated electrodeposited copper. VLP and rolled annealed copper is available upon request
Available with ½ and 1 mil dielectric thicknesses. 1/3 mil (8 μm) thickness under development.
Certifications
Certified to IPC 4821/1
Interra® HK04M embedded capacitance laminate is used between the power and ground planes within a multilayer printed wiring board.
Interra® HK04M provides very low impedance at high frequency, power bus decoupling, and electromagnetic interference reduction. It replaces surface mount by-pass capacitors and their plated-through-holes, which improves the reliability, design flexibility, packaging size and cost of the PWB.
Interra® HK04M is an all-polyimide dielectric laminate that offers the best mechanical properties, reliability and capacitance stability on the market. It can be processed as a thin flexible circuit laminate through the develop/etch/strip process steps. The HK04M dielectric is flexible and can be imaged and etched to remove copper on both sides of the dielectric at the same time.
Applications
- High speed multilayer printed wiring boards
- Servers, routers, telecom
- Backpanels
- Military and Aerospace PWBs
- Graphics Processing Units (GPU)
- PWB's with >4 SMT By-Pass Capacitors per square inch
Benefits of Embedded Capacitance
- Cost reduction by reducing surface mount capacitors and their plated-through-holes
- Reduced inductance for efficient low noise power delivery
- Reduced board size and layer count
- Improved circuit design
- Improved PWB reliability and toughness
- Higher processing yield
Features of Interra® HK04M
- Modified polyimide core to handle thinner dielectric layer (12 μm and less)
- Homogeneous, all-polyimide dielectric layer that will not delaminate during processing
- High initiation and propagation tear strengths contribute to superior handling
- Proven high reliability under extreme conditions
- Excellent capacitance stability over range of frequencies, temperatures and voltages
Constructions
- Available with ½ oz (18 μm), 1 oz (35 μm) and 2 oz (70 μm) copper thicknesses in balanced and unbalanced constructions
- Offered with IPC 4562 Grade 3 reverse treated electrodeposited copper. VLP and rolled annealed copper is available upon request
- Available with ½ and 1 mil dielectric thicknesses. 1/3 mil (8 μm) thickness under development.
Certifications
