Dongguan Sheen Electronic Technology Co., Ltd. Thermal conductive non-silicone gap filler thermal pad for heatsink AF500

The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆ Free from siloxane and the risk of silicone oil bleed. ◆ Self-adhesive for easy application and rework. ◆ Exceptional tensile strength and abrasion resistance. ◆ Customizable die-cut shapes to meet specific customer needs. ◆ Excellent electrical insulation properties. ◆ Superior flame resistance, achieving a UL94 V-0 rating. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. 【Applications】 ◆ Data Center ◆ Automotive sensors ◆ AI devices ◆ Fiber optic communication systems ◆ Industrial control equipment ◆ Hard disk drives ◆ Medical devices