The scribe machines automatically perform parallel alignment and positioning and scribe silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN. It is capable for processing maximum of 4-inch wafers and wafer-to-bar scribing, bar-to-chip scribing
, and full scribing are available. Unlike dicing machines, the scribing is dry-processing, not using water. The device pattern registered for each recipe is recognized in image processing and used for the parallel alignment.
Features
●Simple control screen and touch panel operation ●Applicable to backside patterned wafers as an option ●Unique boat-shapes scribing, providing sharp scribed shapes ●Compact and space-saving
The scribe machines automatically perform parallel alignment and positioning and scribe silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN.
It is capable for processing maximum of 4-inch wafers and wafer-to-bar scribing, bar-to-chip scribing, and full scribing are available. Unlike dicing machines, the scribing is dry-processing, not using water.
The device pattern registered for each recipe is recognized in image processing and used for the parallel alignment.
Features
●Simple control screen and touch panel operation
●Applicable to backside patterned wafers as an option
●Unique boat-shapes scribing, providing sharp scribed shapes
●Compact and space-saving
