B3 Version Chipset
Supports the Intel 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H67 single chip architecture
7 Phases Power Design
Support 4-DIMM DDR3-1333/1066 up to 32G maximum capacity
Support SATA 6Gb/s 2X speed than current SATA 3G
Support USB 3.0
THX(TruStudio Pro) Technology for true studio audio experience
Support Display Port for high definition viewing.
100% X.D.C solid capacitor
BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
BIOSTAR Toverclocker utility
B3 Version Chipset
Supports the Intel 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H67 single chip architecture
7 Phases Power Design
Support 4-DIMM DDR3-1333/1066 up to 32G maximum capacity
Support SATA 6Gb/s 2X speed than current SATA 3G
Support USB 3.0
THX(TruStudio Pro) Technology for true studio audio experience
Support Display Port for high definition viewing.
100% X.D.C solid capacitor
BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
BIOSTAR Toverclocker utility
B3 Version Chipset
Supports the Intel 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H67 single chip architecture
7 Phases Power Design
Support 4-DIMM DDR3-1333/1066 up to 32G maximum capacity
Support SATA 6Gb/s 2X speed than current SATA 3G
Support USB 3.0
THX(TruStudio Pro) Technology for true studio audio experience
Support Display Port for high definition viewing.
100% X.D.C solid capacitor
BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
