B3 Version Chipset
Supports the Intel 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H67 single chip architecture
Support 4-DIMM DDR3-1333/1066 up to 32G maximum capacity
Support ATI CrossfireX Technology
Support SATA 6Gb/s 2X speed than current SATA 3G
Support USB 3.0
100% X.D.C solid capacitor
BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
BIOSTAR Toverclocker utility
Biostar Microtech (U.S.A) Corp.
Done
Description
B3 Version Chipset
Supports the Intel 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H67 single chip architecture
Support 4-DIMM DDR3-1333/1066 up to 32G maximum capacity
Support ATI CrossfireX Technology
Support SATA 6Gb/s 2X speed than current SATA 3G
Support USB 3.0
100% X.D.C solid capacitor
BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
BIOSTAR Toverclocker utility
B3 Version Chipset
Supports the Intel 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H67 single chip architecture
Support 4-DIMM DDR3-1333/1066 up to 32G maximum capacity
Support ATI CrossfireX Technology
Support SATA 6Gb/s 2X speed than current SATA 3G
Support USB 3.0
100% X.D.C solid capacitor
BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
BIOSTAR Toverclocker utility
B3 Version Chipset
Supports the Intel 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H67 single chip architecture
Support 4-DIMM DDR3-1333/1066 up to 32G maximum capacity
Support ATI CrossfireX Technology
Support SATA 6Gb/s 2X speed than current SATA 3G
Support USB 3.0
100% X.D.C solid capacitor
BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
