Support the Intel 3rd and 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H77 single chip architecture
Support 4-DIMM DDR3-2400(OC)/ 2200(OC)/ 2000(OC)/ 1800(OC)/ 1600/ 1333 up to 32G maximum capacity
Support SATA 6Gb/s 2X speed than current SATA 3G
Support USB 3.0
100% X.D.C solid capacitor
BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
BIOSTAR Toverclocker utility
Biostar Microtech (U.S.A) Corp.
Done
Description
Support the Intel 3rd and 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H77 single chip architecture
Support 4-DIMM DDR3-2400(OC)/ 2200(OC)/ 2000(OC)/ 1800(OC)/ 1600/ 1333 up to 32G maximum capacity
Support SATA 6Gb/s 2X speed than current SATA 3G
Support USB 3.0
100% X.D.C solid capacitor
BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
BIOSTAR Toverclocker utility
Support the Intel 3rd and 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H77 single chip architecture
Support 4-DIMM DDR3-2400(OC)/ 2200(OC)/ 2000(OC)/ 1800(OC)/ 1600/ 1333 up to 32G maximum capacity
Support SATA 6Gb/s 2X speed than current SATA 3G
Support USB 3.0
100% X.D.C solid capacitor
BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
BIOSTAR Toverclocker utility
Support the Intel 3rd and 2nd generation Core i7 and Core i5 processors in the 1155 package
Intel H77 single chip architecture
Support 4-DIMM DDR3-2400(OC)/ 2200(OC)/ 2000(OC)/ 1800(OC)/ 1600/ 1333 up to 32G maximum capacity
Support SATA 6Gb/s 2X speed than current SATA 3G
Support USB 3.0
100% X.D.C solid capacitor
BIOSTAR G.P.U (Green Power Utility) Technology for Energy Saving
