Amphenol Communications Solutions OBT-MODULES 10140369-101LF

Description
OBT-MODULES, Leap OPT Socket Assembly, 15x15, 225 pin, Lead Free Solder Balls
Request a Quote
Description
OBT-MODULES, Leap OPT Socket Assembly, 15x15, 225 pin, Lead Free Solder Balls
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
OBT-MODULES - 10140369-101LF - Amphenol Communications Solutions
Nashua, NH, United States
OBT-MODULES
10140369-101LF
OBT-MODULES 10140369-101LF
OBT-MODULES, Leap OPT Socket Assembly, 15x15, 225 pin, Lead Free Solder Balls

OBT-MODULES, Leap OPT Socket Assembly, 15x15, 225 pin, Lead Free Solder Balls

Supplier's Site

Technical Specifications

  Amphenol Communications Solutions
Product Category IC Interconnect Components
Product Number 10140369-101LF
Product Name OBT-MODULES
Product Type IC Socket
Unlock Full Specs
to access all available technical data

Similar Products

Backplane Connector, Vertical Header, 96Pos; Product Range Amphenol Communications Solutions - 63T8495 - Newark, An Avnet Company
Specs
Product Type IC Headers
RoHS Compliant RoHS Compliant
Mounting Press-fit / Solderless Technology; Press Fit
View Details
Conn, Header, 5Pos, 1Row, 2.54Mm Rohs Compliant Amphenol Communications Solutions - 29AK9753 - Newark, An Avnet Company
Specs
Product Type IC Headers
RoHS Compliant RoHS Compliant
View Details
Conn, Header, 24Pos, 2Row, 2.54Mm Rohs Compliant Amphenol Communications Solutions - 29AK9779 - Newark, An Avnet Company
Specs
Product Type IC Headers
RoHS Compliant RoHS Compliant
View Details
Backplane Conn, Header, 30Pos, 5Row, 2Mm; Product Range Amphenol Communications Solutions - 06M2490 - Newark, An Avnet Company
Specs
Product Type IC Headers
RoHS Compliant RoHS Compliant
Mounting Press-fit / Solderless Technology; Press Fit
View Details