MacDermid Alpha Electronics Solutions Structural Adhesive

Description
Structural adhesive for additional bonding of components to flexible and formable circuit tracks. Product Overview XtraForm A9000 is a structural adhesive designed for use with polyethylene terephthalate (PET) and polycarbonate (PC) films to attach active and passive components for in-mold electronics (IME), as well as other integrated electronics and smart structures. It functions through capillary action by being applied directly between the pre-printed pads for the attachment and reinforcement of surface mount device (SMD) components, including LEDs and resistors. XtraForm A9000 is compatible with XtraForm Electrically Conductive Adhesive (ECA), formable silver, and dielectric inks, enabling the fabrication of complex multilayer structures that can be thermoformed and overmolded.
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Description
Structural adhesive for additional bonding of components to flexible and formable circuit tracks. Product Overview XtraForm A9000 is a structural adhesive designed for use with polyethylene terephthalate (PET) and polycarbonate (PC) films to attach active and passive components for in-mold electronics (IME), as well as other integrated electronics and smart structures. It functions through capillary action by being applied directly between the pre-printed pads for the attachment and reinforcement of surface mount device (SMD) components, including LEDs and resistors. XtraForm A9000 is compatible with XtraForm Electrically Conductive Adhesive (ECA), formable silver, and dielectric inks, enabling the fabrication of complex multilayer structures that can be thermoformed and overmolded.
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Suppliers

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Description
Supplier Links
Structural Adhesive -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Structural Adhesive
Structural Adhesive
Structural adhesive for additional bonding of components to flexible and formable circuit tracks. Product Overview XtraForm A9000 is a structural adhesive designed for use with polyethylene terephthalate (PET) and polycarbonate (PC) films to attach active and passive components for in-mold electronics (IME), as well as other integrated electronics and smart structures. It functions through capillary action by being applied directly between the pre-printed pads for the attachment and reinforcement of surface mount device (SMD) components, including LEDs and resistors. XtraForm A9000 is compatible with XtraForm Electrically Conductive Adhesive (ECA), formable silver, and dielectric inks, enabling the fabrication of complex multilayer structures that can be thermoformed and overmolded.

Structural adhesive for additional bonding of components to flexible and formable circuit tracks.

Product Overview

XtraForm A9000 is a structural adhesive designed for use with polyethylene terephthalate (PET) and polycarbonate (PC) films to attach active and passive components for in-mold electronics (IME), as well as other integrated electronics and smart structures. It functions through capillary action by being applied directly between the pre-printed pads for the attachment and reinforcement of surface mount device (SMD) components, including LEDs and resistors. XtraForm A9000 is compatible with XtraForm Electrically Conductive Adhesive (ECA), formable silver, and dielectric inks, enabling the fabrication of complex multilayer structures that can be thermoformed and overmolded.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Industrial Adhesives
Product Name Structural Adhesive
Features Electrically Conductive
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