MacDermid Alpha Electronics Solutions STAYSTIK ® 892

Alumina Filled Dielectric Film Product Overview STAYSTIK 892 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding at low process temperatures. Its properties make it exceptional for heat sink and substrate bonding as well as TAB bonding to PCB. The unique reworkability of this thermoplastic adhesive system offers many advantages in applications traditionally ill-suited to thermoset adhesives. Features Fast bonding to a variety of substrates Easily reworkable material