MacDermid Alpha Electronics Solutions STAYSTIK ® 682

Description
Aluminum nitride-filled thermoplastic film for electronics, offering strong bonding for MCMs and reworkability. Product Overview STAYSTIK 682 Thermoplastic Adhesive Film is designed for a variety of electronic applications and delivers excellent bonding performance. It is suitable for die attach and/or substrate attach in hybrid or multi-chip modules (MCMs). The unique reworkable nature of this thermoplastic adhesive system provides significant advantages in applications typically challenging for thermoset adhesives.
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Description
Aluminum nitride-filled thermoplastic film for electronics, offering strong bonding for MCMs and reworkability. Product Overview STAYSTIK 682 Thermoplastic Adhesive Film is designed for a variety of electronic applications and delivers excellent bonding performance. It is suitable for die attach and/or substrate attach in hybrid or multi-chip modules (MCMs). The unique reworkable nature of this thermoplastic adhesive system provides significant advantages in applications typically challenging for thermoset adhesives.
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STAYSTIK ® 682 -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
STAYSTIK ® 682
STAYSTIK ® 682
Aluminum nitride-filled thermoplastic film for electronics, offering strong bonding for MCMs and reworkability. Product Overview STAYSTIK 682 Thermoplastic Adhesive Film is designed for a variety of electronic applications and delivers excellent bonding performance. It is suitable for die attach and/or substrate attach in hybrid or multi-chip modules (MCMs). The unique reworkable nature of this thermoplastic adhesive system provides significant advantages in applications typically challenging for thermoset adhesives.

Aluminum nitride-filled thermoplastic film for electronics, offering strong bonding for MCMs and reworkability.

Product Overview

STAYSTIK 682 Thermoplastic Adhesive Film is designed for a variety of electronic applications and delivers excellent bonding performance. It is suitable for die attach and/or substrate attach in hybrid or multi-chip modules (MCMs). The unique reworkable nature of this thermoplastic adhesive system provides significant advantages in applications typically challenging for thermoset adhesives.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Thin Film Materials
Product Name STAYSTIK ® 682
Applications Semiconductors
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