Silver-filled conductive film offers strong bonding for MCMs and superior reworkability compared to thermosets.
Product Overview
STAYSTIK 581 is a thermoplastic adhesive designed for a variety of electronic applications, offering excellent bonding performance. It is well suited for substrate attachment in hybrid or multi-chip modules (MCMs). Its reworkable formulation provides key advantages in applications where thermoset adhesives are typically less effective.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Name | STAYSTIK ® 581 |
| Cure / Technology | Thermoplastic / Hot Melt; Thermoset |
