MacDermid Alpha Electronics Solutions High-Reliability Thermoplastic Adhesives for Microelectronics STAYSTIK ® 336T

Product Overview A solvent-based polymer specially developed for temporary bonding applications. STAYSTIK 336T thermoplastic adhesive paste is a low-modulus polymer specially developed for temporary bonding applications, most typically associated with GaAs and silicon wafer thinning. It can also be used for various applications where temporary adhesion is necessary. This adhesive can be easily debonded in Isopropyl Alcohol (IPA). Product Features Fast Bonding STAYSTIK® 336T bonds quickly to a variety of substrates, enabling an efficient workflow in production environments. Reworkable It can be easily debonded using Isopropyl Alcohol (IPA), leaving no residue or contamination. This makes it ideal for processes that require temporary adhesion. Low Outgassing and Low Ionics These properties help prevent contamination, making it suitable for sensitive applications in the aerospace, medical, and electronics industries. Featured Applications Wafer Thinning Used to secure wafers during thinning, where precision is crucial to avoid damaging delicate semiconductor structures. Substrate Cutting Provides temporary bonding for substrates or wafers before cutting, ensuring stability throughout the process. Lens Polishing Maintains alignment and stability of components during polishing, which is critical for achieving the required surface finish and accuracy. Packaging Effective for temporary bonding during complex packaging processes, including System-In-Package (SiP) and heterogeneous integration.