MacDermid Alpha Electronics Solutions ALPHA ® TrueHeight ® Solder Preforms For Power Electronics

Solder Preforms with Embedded Bond Line Control Product Overview ALPHA TrueHeight Preforms contain embedded bondline control wires that maintain a minimum bondline of the solder joint after reflow, ensuring solder joint reliability. Multiple bondline control mechanisms can be included in a single solder preform to prevent tilt while ensuring a minimum bondline for applications such as warped substrate soldering. These preforms are available in a wide range of sizes, suitable for clip attachment, as well as substrate and heat spreader attachment applications.