Advanced leadframe adhesion technology designed to overcome delamination problems to achieve MSL-1 reliability.
Product Overview
PackageBond is the no-risk adhesion promotion system specifically engineered for optimal adhesion at today’s intense lead-free circuit assembly temperatures. Production-proven in high volume at premier semiconductor manufacturing facilities, our advanced laboratory innovations deliver extreme heat tolerance to leadframe packages.
Proven Reliability at MSL-1 Without Delamination
PackageBond features patented chemistries that prevent delamination failures of molded packages due to moisture and reflow sensitivity.
Improved Adhesion Performance in Modern Chip Packages
The PackageBond process roughens copper alloy leadframes to maximize resin and encapsulation adhesion and deposits a thin adhesion booster for long-term delamination protection.
No Risk of Damage to Leadframe Platings
PackageBond does not degrade Ag or Ni/Pd/Au plated features and is compatible with wire bond, flip chip, and copper clip attach technologies.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Name | PackageBond |
| Industry | Electronics; Semiconductors, IC's |
