MacDermid Alpha Electronics Solutions MultiPrep 200

Adhesion promoter that enables superior bonding for solder mask, dry film, and liquid photoresist on copper. Product Overview The MultiPrep 200 adhesion promoter process creates an ideal surface for soldermask, dry film, and liquid photoresist adhesion on copper. By eliminating pumice and brush scrubbing, MultiPrep 200 provides a uniform copper surface topography, surpassing traditional bonding consistency. Micro-Roughened Surface The process delivers a micro-roughened surface excellent for soldermask adhesion to microvias and ultra-fine features, while also creating a strong, reliable bond between via fill and PTH copper. Optimized Copper Surface Roughening The enhanced bond between the soldermask coating and copper prevents adhesion loss during subsequent processes such as immersion tin plating, HASL, and final assembly. Excellent Compatibility MultiPrep 200 is compatible with all final finish chemistries, including ENIG, silver, OSP, and immersion tin finishes.