MacDermid Alpha Electronics Solutions Immersion Tin Surface Finish for PCBs MacStan HSR 3.0

Description
Product Overview MacStan HSR 3.0 is an immersion tin plating process specifically designed to inhibit whisker formation and deliver a tin deposit with an extended shelf life of up to 12 months. As a high-performance solution from the leader in final finishes, MacStan HSR 3.0 offers a chemically stable, low-foaming, and efficient application process that delivers excellent Pb-free solderability and an exceptionally planar surface. With its high resistance to corrosion, MacStan HSR 3.0 enables effortless thickness control while maximizing bath and process stability. This leads to higher yields and reduced waste. Fabricators, assemblers, and OEMs can rely on MacStan HSR 3.0 to help meet both RoHS requirements and WEEE directives.
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Description
Product Overview MacStan HSR 3.0 is an immersion tin plating process specifically designed to inhibit whisker formation and deliver a tin deposit with an extended shelf life of up to 12 months. As a high-performance solution from the leader in final finishes, MacStan HSR 3.0 offers a chemically stable, low-foaming, and efficient application process that delivers excellent Pb-free solderability and an exceptionally planar surface. With its high resistance to corrosion, MacStan HSR 3.0 enables effortless thickness control while maximizing bath and process stability. This leads to higher yields and reduced waste. Fabricators, assemblers, and OEMs can rely on MacStan HSR 3.0 to help meet both RoHS requirements and WEEE directives.
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Immersion Tin Surface Finish for PCBs - MacStan HSR 3.0 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Immersion Tin Surface Finish for PCBs
MacStan HSR 3.0
Immersion Tin Surface Finish for PCBs MacStan HSR 3.0
Product Overview MacStan HSR 3.0 is an immersion tin plating process specifically designed to inhibit whisker formation and deliver a tin deposit with an extended shelf life of up to 12 months. As a high-performance solution from the leader in final finishes, MacStan HSR 3.0 offers a chemically stable, low-foaming, and efficient application process that delivers excellent Pb-free solderability and an exceptionally planar surface. With its high resistance to corrosion, MacStan HSR 3.0 enables effortless thickness control while maximizing bath and process stability. This leads to higher yields and reduced waste. Fabricators, assemblers, and OEMs can rely on MacStan HSR 3.0 to help meet both RoHS requirements and WEEE directives.

Product Overview

MacStan HSR 3.0 is an immersion tin plating process specifically designed to inhibit whisker formation and deliver a tin deposit with an extended shelf life of up to 12 months.

As a high-performance solution from the leader in final finishes, MacStan HSR 3.0 offers a chemically stable, low-foaming, and efficient application process that delivers excellent Pb-free solderability and an exceptionally planar surface. With its high resistance to corrosion, MacStan HSR 3.0 enables effortless thickness control while maximizing bath and process stability. This leads to higher yields and reduced waste. Fabricators, assemblers, and OEMs can rely on MacStan HSR 3.0 to help meet both RoHS requirements and WEEE directives.

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Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Cleaning Agents and Surface Treatments
Product Number MacStan HSR 3.0
Product Name Immersion Tin Surface Finish for PCBs
Type Surface Treatment; Cleaner
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