Via filling solutions for any metallization challenge.
Product Overview
The MacuSpec™ VF, AVF, and VF-TH series are production-proven processes that are specifically engineered to fill blind micro vias. The VF-TH series processes are also able to simultaneously plate through holes in the same bath.
Product Features
MacuSpec VF Series – General via filling in panel or pattern plating mode.
MacuSpec AVF Series – Advanced via filling for Any Layer applications.
MacuSpec VF-TH Series – Multifunctional processes for mSAP and SAP.
Via filling solutions for any metallization challenge.
Product Overview
The MacuSpec™ VF, AVF, and VF-TH series are production-proven processes that are specifically engineered to fill blind micro vias. The VF-TH series processes are also able to simultaneously plate through holes in the same bath.
Product Features
- MacuSpec VF Series – General via filling in panel or pattern plating mode.
- MacuSpec AVF Series – Advanced via filling for Any Layer applications.
- MacuSpec VF-TH Series – Multifunctional processes for mSAP and SAP.
