MacDermid Alpha Electronics Solutions Advanced Hybrid Sintering Die Attach Solutions ATROX ® 850HT1

Description
Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low resin bleed out and low condensable organics ensure excellent package reliability.
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Description
Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low resin bleed out and low condensable organics ensure excellent package reliability.
Request a Quote

Suppliers

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Advanced Hybrid Sintering Die Attach Solutions - ATROX ® 850HT1 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Advanced Hybrid Sintering Die Attach Solutions
ATROX ® 850HT1
Advanced Hybrid Sintering Die Attach Solutions ATROX ® 850HT1
Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low resin bleed out and low condensable organics ensure excellent package reliability.

Product Overview

ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low resin bleed out and low condensable organics ensure excellent package reliability.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Industrial Adhesives
Product Number ATROX ® 850HT1
Product Name Advanced Hybrid Sintering Die Attach Solutions
Cure / Technology Thermoset
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