MacDermid Alpha Electronics Solutions Advanced Conductive Die Attach for Semiconductors ATROX ® 558-2C31

Product Overview ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era of high-performance materials. Product Features Thermal Conductivity The ATROX 558-2C31 offers good thermal conductivity, greater than 5 W/m-K, making it ideal for applications that require efficient heat dissipation. Compatibility with Multi Leadframe Surfaces This adhesive is compatible with various leadframe surfaces, including Copper (Cu) and pre-plated frames (NiPdAu), offering versatility in packaging. Low Outgassing and Moisture Resistance It features low outgassing properties and excellent moisture resistance, enhancing its performance and longevity in high-reliability environments. Featured Applications Power Semiconductors It is commonly used in power semiconductor and power discrete device packaging, where efficient thermal management and mechanical stability are critical. Medical / Aerospace Its reliability and low outgassing make it ideal for sensitive applications, such as medical devices and aerospace components.