MacDermid Alpha Electronics Solutions ALPHA ® HiTech ® CF31-4026 Edgebond

Next-generation, high reliability, reworkable edgebond. Product Overview ALPHA HiTech CF31-4026 is a reworkable edgebond with high Tg and low CTE, purposefully engineered for high-temperature automotive applications that require exceptional board-level reliability. With superior thermal cycling performance and reworkability at temperatures as low as 185°C, this advanced edgebond offers improved process yields to help reach sustainability objectives. Versatile in its applications, CF31-4026 extends its robust reinforcement to high reliability markets such as high-performance computing. This edgebond reinforces the BGA while avoiding contact with solder interconnects beneath the component. Its fluorescent appearance aids in efficient and accurate visual inspection. For industries that require both high temperature resilience and component reinforcement for extended operational life, ALPHA HiTech CF31-4026 is the optimal solution. High Tg Ideal for automotive and other high-temperature applications. Low α1 Enabling excellent TCT performance for board-level reliability. Reworkable Edgebond Removable at 185-200°C for high-yield manufacturing and lower total cost of ownership (TCO). Superior Slump Performance Prevents material from spreading to solder interconnects beneath components, maintaining integrity and reliability in high-density PCBs. Fluorescent Appearance Enabling visual detection under UV light.