MacDermid Alpha Electronics Solutions ALPHA ® HiTech ® AD13-9692B

A single-component epoxy system ideal for bonding heat-sensitive devices and designed for camera module applications. Product Overview A one-component, low-temperature curing epoxy adhesive designed specifically for bonding heat-sensitive devices. Ideal for applications in camera modules and other optical devices where low thermal exposure is critical, the AD13-9692B offers strong adhesion at temperatures low enough to prevent damage to sensitive components, while maintaining flexibility in automated manufacturing. Low-Temperature Cure Allows for effective bonding at temperatures as low as 80°C, reducing the risks of heat damage to sensitive components. Single-Component Adhesive Simplifies the manufacturing process by eliminating the need for mixing, helping to maintain consistent quality. High Adhesion on Diverse Substrates Compatible with substrates like stainless steel, polyimide, and LCP, broadening its range of applications.