Product Overview
ALPHA High Lead Die Attach Preforms are constructed with 99.99% (4N) purity PbSn, PbSnAg, and PbSb alloys. To minimize oxidation during storage and shipping, these products are packaged in glass jars flooded with Argon and are hermetically sealed. These products are typically reflowed with forming gas at very high reflow temperatures. Shapes include discs, squares, and rectangles. These preforms are available in a wide range of sizes, specifically for die attach applications.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | ALPHA ® High Lead Die Attach Solder Preforms-Power Electronics |
| Product Name | Precision Preforms for Power Module Assembly |
