Sinter silver paste for die attachment on copper, designed for wet paste placement and low-pressure sintering.
Product Overview
ALPHA Argomax 5040 Paste is a silver sintering paste developed for die placement on wet paste prior to drying, followed by low-pressure sintering die attachment on copper-finished surfaces. It is formulated for printing or dot dispensing on Cu surfaces and is designed to support die placement directly on the wet paste. The resulting pure silver bond line delivers high performance and reliability with excellent thermal and electrical conductivity. Its low sintering pressure supports high-yield manufacturing.
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Soldering Irons, Stations, and Accessories |
| Product Name | ALPHA ® Argomax ® 5040 Paste |
