Sinter Silver Paste for Die Attachment on Copper surface with Wet Die Placement
Product Overview
ALPHA Argomax 5040 Paste is a silver sintering paste specifically designed for die placement on wet paste (before drying) followed by low pressure sintering die attachment on copper finish surfaces.
Product Features
Application: Die Attach, Die Top Attach
Formulated for printing or dot dispense on Cu surfaces
Designed for die placement on wet paste
Pure Silver bond line for high performance and reliability
High thermal and electrical conductivity
Low sintering pressure for high yield manufacturing
Sinter Silver Paste for Die Attachment on Copper surface with Wet Die Placement
Product Overview
ALPHA Argomax 5040 Paste is a silver sintering paste specifically designed for die placement on wet paste (before drying) followed by low pressure sintering die attachment on copper finish surfaces.
Product Features
- Application: Die Attach, Die Top Attach
- Formulated for printing or dot dispense on Cu surfaces
- Designed for die placement on wet paste
- Pure Silver bond line for high performance and reliability
- High thermal and electrical conductivity
- Low sintering pressure for high yield manufacturing
