MacDermid Alpha Electronics Solutions Semiconductor Solder Pastes for Electronics ALPHA ® WS-945CPS Solder Paste

Product Overview ALPHA WS-945CPS is specifically designed for System-in-Package (SiP) applications involving numerous small components. It is optimized for the smallest solder powders, including Types 6 and 7, and is compatible with a wide range of lead-free solder alloys, making it an ideal solution for devices with precise and diverse requirements. Product Features Reliable Consistent printing performance with apertures as small as 50μm, using a 25μm stencil. Print Performance Excellent repeatability in print volume deposition. Meets Requirements Compliance with IPC 7095 Class III voiding requirements. Featured Applications High Density ALPHA® WS945CPS SAC305 Type 7 solder paste is designed for fine-pitch and high-density applications, providing excellent print resolution. Fine Pitch ALPHA® WS945CPS SAC305 Type 7 solder paste is designed for fine-pitch and high-density applications.