MacDermid Alpha Electronics Solutions Affinity ™ ENIG

Optimized process that creates an extremely uniform nickel-phosphorus distribution and low variation in pad-to-pad gold thickness. Product Overview Each process step of Affinity ENIG is optimized to work together, creating an extremely uniform nickel-phosphorous distribution and low variation in pad-to-pad gold thickness. As a result, the entire process is highly resistant to penetrating corrosion and easily conforms to all known specifications, including the stringent IPC 4552 A and B. Developed with Six Sigma Methodology A data-driven approach, from concept to mass production, eliminates waste, improves yield, and enhances reliability by minimizing process variation. Significant Cost of Ownership Improvements Elimination of dummy waste, maximized bath life, reduced chemical waste and maintenance, and best-in-class use of precious metals. Reduced Corrosion Consistently low electroless nickel corrosion, providing the highest level of conformance to IPC 4552 A and B.