ASML Optics Lithography System TWINSCAN XT:1450G

Description
The TWINSCAN XT:1450G 193-nm Step-and-Scan system is a high-productivity, dual-stage ArF lithography tool designed for volume 200-mm and 300-mm wafer production at 65-nm resolution. The TWINSCAN XT:1450G system combines the imaging power of a variable 0.65–0.93-NA Carl Zeiss Starlith 4X reduction lens with AERIAL-E Illuminator technology, extending ArF technology beyond the 65-nm technology node. The dual wafer-stage technology of the TWINSCAN platform enables the exposure of one wafer and the alignment of the next wafer to take place in parallel, virtually eliminating overhead time and allowing for continuous patterning of wafers for maximum productivity. The off-line leveling system guarantees superior focus control over the full wafer, including edge dies. A standardly delivered 45-W ArF laser with variable frequency control, in combination with the high optical transmission of the complete system, provides a production throughput of 145wph (300mm) and 180wph (200mm) with the lowest possible cost of operation. The tool is prepared to operate at extreme low-k1 values. Capabilities are implemented increasing the process window, delivering improved CD uniformity and focus behavior. On-board metrology allows for sophisticated process monitoring.
Description
The TWINSCAN XT:1450G 193-nm Step-and-Scan system is a high-productivity, dual-stage ArF lithography tool designed for volume 200-mm and 300-mm wafer production at 65-nm resolution. The TWINSCAN XT:1450G system combines the imaging power of a variable 0.65–0.93-NA Carl Zeiss Starlith 4X reduction lens with AERIAL-E Illuminator technology, extending ArF technology beyond the 65-nm technology node. The dual wafer-stage technology of the TWINSCAN platform enables the exposure of one wafer and the alignment of the next wafer to take place in parallel, virtually eliminating overhead time and allowing for continuous patterning of wafers for maximum productivity. The off-line leveling system guarantees superior focus control over the full wafer, including edge dies. A standardly delivered 45-W ArF laser with variable frequency control, in combination with the high optical transmission of the complete system, provides a production throughput of 145wph (300mm) and 180wph (200mm) with the lowest possible cost of operation. The tool is prepared to operate at extreme low-k1 values. Capabilities are implemented increasing the process window, delivering improved CD uniformity and focus behavior. On-board metrology allows for sophisticated process monitoring.

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Lithography System - TWINSCAN XT:1450G - ASML Optics
Wilton, CT, USA
Lithography System
TWINSCAN XT:1450G
Lithography System TWINSCAN XT:1450G
The TWINSCAN XT:1450G 193-nm Step-and-Scan system is a high-productivity, dual-stage ArF lithography tool designed for volume 200-mm and 300-mm wafer production at 65-nm resolution. The TWINSCAN XT:1450G system combines the imaging power of a variable 0.65–0.93-NA Carl Zeiss Starlith 4X reduction lens with AERIAL-E Illuminator technology, extending ArF technology beyond the 65-nm technology node. The dual wafer-stage technology of the TWINSCAN platform enables the exposure of one wafer and the alignment of the next wafer to take place in parallel, virtually eliminating overhead time and allowing for continuous patterning of wafers for maximum productivity. The off-line leveling system guarantees superior focus control over the full wafer, including edge dies. A standardly delivered 45-W ArF laser with variable frequency control, in combination with the high optical transmission of the complete system, provides a production throughput of 145wph (300mm) and 180wph (200mm) with the lowest possible cost of operation. The tool is prepared to operate at extreme low-k1 values. Capabilities are implemented increasing the process window, delivering improved CD uniformity and focus behavior. On-board metrology allows for sophisticated process monitoring.

The TWINSCAN XT:1450G 193-nm Step-and-Scan system is a high-productivity, dual-stage ArF lithography tool designed for volume 200-mm and 300-mm wafer production at 65-nm resolution. The TWINSCAN XT:1450G system combines the imaging power of a variable 0.65–0.93-NA Carl Zeiss Starlith 4X reduction lens with AERIAL-E Illuminator technology, extending ArF technology beyond the 65-nm technology node. The dual wafer-stage technology of the TWINSCAN platform enables the exposure of one wafer and the alignment of the next wafer to take place in parallel, virtually eliminating overhead time and allowing for continuous patterning of wafers for maximum productivity. The off-line leveling system guarantees superior focus control over the full wafer, including edge dies. A standardly delivered 45-W ArF laser with variable frequency control, in combination with the high optical transmission of the complete system, provides a production throughput of 145wph (300mm) and 180wph (200mm) with the lowest possible cost of operation.

The tool is prepared to operate at extreme low-k1 values. Capabilities are implemented increasing the process window, delivering improved CD uniformity and focus behavior. On-board metrology allows for sophisticated process monitoring.

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Technical Specifications

  ASML Optics
Product Category Lithography Equipment
Product Number TWINSCAN XT:1450G
Product Name Lithography System
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